A fastening mechanism for retaining a heat sink upon the CPU includes a fastening seat surrounding the connector, and a pair of fastening clips. The fastening seat includes four alignment posts at four corners, and the pair of fastening clips are attached at two corresponding diagonal corners. Each fastening clip includes a mounting section secured to the corresponding post, a latching section for temporarily holding the heat sink, and a resilient arm for upwardly urging the heat sink, Each alignment post is equipped with a screw nut and a coil spring so as to reinforce the downward pressing forces against the heat sink for assuring reliable connection between the CPU and the contacts of the electrical connector for better electrical transmission and intimate contact between the CPU and the heat sink for efficient heat dissipation

A heat dissipation device includes a heat diffusion plate, a resin unit, and a connecting unit. The heat diffusion plate is configured such that the first surface is overlapped with an electronic component via a heat conductive material. The resin unit integrally includes a contact portion, an outer frame portion, and a deformation portion. The contact portion is configured so that at least a part thereof can make surface contact with the second surface of the heat diffusion plate opposite from the first surface. The outer frame portion is configured to surround the contact portion with a gap from the surroundings to form a part of a housing surrounding the electronic component and the heat diffusion plate. The deformation portion is provided between the outer frame portion and the contact portion, and is configured to elastically deform when the contact portion is pressed against the second surface.

A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

A fixing structure for heat dissipation assembly includes a base and multiple female fastener holders. The base has at least one through bore axially extending through an upper and a lower surface thereof, as well as coupling holes located outside the through bore and respectively having an engaging element disposed therein. The female fastener holder has a lower side formed with coupling protrusions corresponding to the coupling holes. The coupling protrusion has a guiding groove radially provided thereon and having a lower and an upper end recess for engaging with the engaging element in the corresponding coupling hole. The engaging elements in the coupling holes are guided by the guiding grooves to move from the lower to the upper recesses when the female fastener holder is turned relative to the through bore and the coupling holes on the base, bringing the coupling protrusions to axially insert into the coupling holes.

An electrical assembly includes an electrical connector mounted upon the PCB to receive a CPU therein. A securing seat is fixed on the PCB with four upwardly extending posts. A heat sink is secured to the posts by the screw nuts and seated upon the CPU. A auxiliary retention piece is located upon the securing seat around one post so as to prevent the CPU from excessively tilting due to the screw nut fastening occurring on an opposite diagonal corner.

A clamping mechanism adapted to clamp a heat sink on a housing of an electronic device comprises a frame, a plurality of mounting legs connected on the frame, and a plurality of elastic tabs obliquely extending from the frame towards the heat sink. The frame has a rectangular shape and includes a first arm adapted to be connected to a front end of the housing, a second arm adapted to be connected to a rear end of the housing, and a pair of third arms connected between the first arm and the second arm. The mounting legs are configured to mount the frame on the housing. The elastic tabs press the heat sink against the housing. Each of the third arms has at least one of the elastic tabs.

Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

An improved power semiconductor heat dissipation apparatus for regulating the temperature of multiple power semiconductors featuring increased structural integrity for high pressure applications, a more robust heat exchange fin design to accommodate particulates or other solid contaminants that may be present in less refined coolant fluids, and a modified construction for increased durability and ease of automated assembly.

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

A memory heat dissipation unit is disclosed. The memory heat dissipation unit includes a main body having a first portion, a second portion and a connection portion having two lateral edges separately connected to the first and the second portion. The first and the second portion have at least one first heat-receiving section and at least one second heat-receiving section formed thereon, respectively; and the first and the second heat-receiving section are correspondingly in contact with at least one memory chip each to exchange heat with the chips and accordingly cool the same.