A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.

An electrical connector is essentially composed of a pair of half housings opposite to each other in a longitudinal direction to commonly form a receiving cavity for receiving a CPU. Each half housing is equipped with a plurality of contacts with corresponding contacting sections upwardly extending into the receiving cavity for mating with the CPU. A single pick-up cap includes a plate with a plurality of claws adapted to be engaged within locking recesses in exterior sides of the half housings, a plurality of positioning blocks adapted to extend into the receiving cavity so as to cooperate with the claws to sandwich the periphery wall of the housing therebetween in the longitudinal direction for securing the half housings to the pick-up cap. Therefore, both the pair of half housings may be grasped by the single pick-up cap for mounting and soldering to PCB at the same time.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the lead frame.

Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

A power electronics unit for an electric motor of a motor vehicle drive, having a plate-like cooling element, at least one semiconductor module and a module holder which consists of plastic and secures the at least one semiconductor module relative to the cooling element. The module holder is fixed to the cooling element via an interlocking snap connection.

A heat dissipation device includes a heat diffusion plate, a resin unit, and a connecting unit. The heat diffusion plate is configured such that the first surface is overlapped with an electronic component via a heat conductive material. The resin unit integrally includes a contact portion, an outer frame portion, and a deformation portion. The contact portion is configured so that at least a part thereof can make surface contact with the second surface of the heat diffusion plate opposite from the first surface. The outer frame portion is configured to surround the contact portion with a gap from the surroundings to form a part of a housing surrounding the electronic component and the heat diffusion plate. The deformation portion is provided between the outer frame portion and the contact portion, and is configured to elastically deform when the contact portion is pressed against the second surface.

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.