The present invention relates to a method for fabricating an integrated electronic device with a microchannel, comprising the steps of: —Providing a homogeneous or heterogeneous substrate with one or more layers of material, respectively; —Forming at least one trench in the upper surface and through the upper layer using an etching process, particularly using a high aspect ratio etching process; —Sealing the trench by closing the opening of the trench on an upper surface of the upper layer.

A semiconductor device includes a semiconductor element, a first wiring member, a second wiring member, and a terminal. The semiconductor element includes a first main electrode and a second main electrode on a side opposite from the first main electrode. The first wiring member is connected to the first main electrode. The terminal has a first terminal surface connected to the second main electrode and a second terminal surface. The second terminal has four sides. Two of the four sides are parallel to a first direction intersecting the thickness direction, and other two sides of the four sides are parallel to a second direction perpendicular to the thickness direction and the first direction. The second wiring member is connected to the second terminal surface of the terminal through solder, and has a groove. The groove overlaps one or two of the four sides of the second terminal surface.

A system for cooling computer hardware includes a first heat exchanger and a pump. The first heat exchanger includes a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side. The first heat exchanger also includes a liquid chamber having a pump interface with at least one chamber inlet and at least one chamber outlet. The pump includes a chamber interface with at least one pump outlet and at least one pump inlet. The pump is configured to: detachably connect at the chamber interface to the pump interface, and drive the cooling liquid from a second heat exchanger to the at least one pump outlet and from the at least one a pump inlet to the second heat exchanger.

A liquid cooling jacket includes a refrigerant flow path which is a flow path having a width in a second direction and in which a heat dissipation assembly is located on a first side in a third direction, where a direction in which a refrigerant flows is defined as a first direction. The refrigerant flow path includes a narrow flow path portion. A width in the third direction of the narrow flow path portion is smaller than a width in the third direction of a flow path on a first side in the first direction with respect to the narrow flow path portion and a width in the third direction of a flow path on a second side in the first direction with respect to the narrow flow path portion.

A 3D device, the device including: at least a first level including logic circuits; and at least a second level bonded to the first level, where the second level includes a plurality of transistors, where the device include connectivity structures, where the connectivity structures include at least one of the following: a. differential signaling, or b. radio frequency transmission lines, or c. Surface Waves Interconnect (SWI) lines, and where the bonded includes oxide to oxide bond regions and metal to metal bond regions.

A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.

A cyclic cooling embedded packaging substrate and a manufacturing method thereof are disclosed. The packaging substrate includes a dielectric material body, a chip, a first metal face, a second metal face and a first trace. The dielectric material body is provided with a packaging cavity, the chip is packaged in the packaging cavity, the first metal face is embedded in the dielectric material body, covers and is connected to a heat dissipation face of the chip. The second metal face is embedded in the dielectric material body, connected to a surface of the first metal face, and is provided with a first cooling channel pattern for forming a cooling channel. The first trace is arranged on a surface of the dielectric material body or embedded therein, and is connected with a corresponding terminal on an active face of the chip through a first conductive structure.

The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm.sup.3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.