A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

A fluidic device is disclosed, comprising an enclosed passage that is adapted to convey a circulating fluid. The enclosed passage comprises a flow unit having a first electrode and a second electrode offset from the first electrode in a downstream direction of a flow of the circulating fluid. The first electrode is formed as a grid structure and arranged to allow the circulating fluid to flow through the first electrode. The fluidic device may be used for controlling or regulating the flow of the fluid circulating in the enclosed passage, and thereby act as a valve opening, reducing or even closing the passage.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

A heat dissipation structure including a plurality of heat dissipating members, and a support plate for supporting the heat dissipating members. Each of the heat dissipating members includes a plurality of cushion members each having a hollow or a solid shape, and a heat conduction sheet covering an outer surface of the cushion members. The support plate includes a plurality of grooves for supporting the heat dissipating members in a direction orthogonal to a longitudinal direction of the heat dissipating members. Each of the grooves is a curved recess portion formed in a thickness direction, opened to the side of the heat dissipating member, formed to have a radius of curvature larger than a radius of curvature of the heat dissipating member, and to have a depth smaller than a circular conversion diameter of the heat dissipating member, and a battery provided with the heat dissipating structure.

Provided is an imaging device capable of efficiently dissipating heat from an imaging element. An imaging device 100 includes: an imaging element substrate 4 on which an insulating layer 51 and a conductor layer 52 are stacked and an imaging element 41 is mounted; and a housing 1 that accommodates the imaging element substrate 4. The surface of the imaging element substrate 4 has a mounting region 45 on which an electronic component 43 including the imaging element 41 is mounted, a covered region 46 in which the conductor layer 52 is covered with the insulating layer 51, and an exposed region 47 in which the conductor layer 52 is exposed from the insulating layer 51, and the exposed region 47 is connected to the housing 1.

A liquid-cooled plate and a heat dissipation device are disclosed. The liquid-cooled plate includes a single-phase channel and a two-phase channel. First fins are spaced apart in the single-phase channel and second fins are spaced apart in the two-phase channel. The first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant, and the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange.

The resin material 336 is arranged in a first region 421 surrounded by the fin base 440, the inclined portion 343 of the cover member 340, and the outermost peripheral heat dissipation fins 334 arranged on the outermost peripheral side. Then, the resin material 336 is caused to protrude to the first region 421. That is, the resin material 336 is arranged in the first region 421. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first region 421 is larger than an average cross-sectional area 423 of the adjacent heat dissipation fins 331. Then, a cross-sectional area of a second region 422 formed between the resin material 336 arranged in the first region 421 and the outermost peripheral heat dissipation fin 334 arranged on the outermost peripheral side is smaller than the average cross-sectional area 423 of the heat dissipation fins.