A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.

The present invention provides a display device including a substrate, a wiring electrode disposed on the substrate, and a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and made of a mixture of conductive particles and an insulating material, and a light transmitting layer formed between the semiconductor light emitting devices. And the anisotropic conductive layer is formed in plurality, and any one of the plurality of anisotropic conductive layers is formed to surround one semiconductor light emitting device or to surround a plurality of semiconductor light emitting devices adjacent to each other.

A display device includes a substrate including a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface, a plurality of subpixels on the first surface, a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate, and a circuit board on the second surface. The side wiring comprises a first portion on the first surface and a second portion on the first side surface, and includes metal particles where a packing density of the metal particles in the first portion is higher than a packing density of the metal particles in the second portion.

A display device includes a substrate including a display area in which a plurality of sub-pixels are disposed, a plurality of anode electrodes respectively connected to the plurality of sub-pixels, and a cathode electrode connected to the plurality of sub-pixels and spaced apart from each of the plurality of anode electrodes. Each of the plurality of anode electrodes is disposed closer to the substrate than the cathode electrode by a height difference compensation part.

A display device includes: a substrate; a transistor layer on a first surface of the substrate; a pad portion; a first via layer on the transistor layer, and spaced from the pad portion; a second via layer on the first via layer, and exposing an upper surface of the first via layer; a third via layer on the second via layer, and exposing an upper surface of the second via layer; a display element layer on the third via layer; a lead line on a second surface of the substrate; a side surface connection line on the first surface, the second surface, and a side surface between the first surface and the second surface, the side surface connection line electrically connecting the pad portion to the lead line; and an over-coating layer covering the side surface connection line, and overlapping with the exposed upper surface of the first via layer.

A display device is provided, a display device includes, a substrate including a first surface, a second surface opposite to the first surface, a first chamfered surface extending from one side of the first surface, a second chamfered surface extending from one side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface to each other, a first pad on the first surface, an upper via layer on the first surface and spaced from the first pad, and a first passivation layer partially covering the upper via layer, and defining a first exposure opening exposing one side of the upper via layer facing the first pad.

A light emitting diode (LED) module includes a substrate layer including an active area and a non-active area excluding the active area, at least one wiring layer provided on the substrate layer, and a test pad connected to the at least one wiring layer and provided in the non-active area.

A light emitting device has a substrate, a plurality of light emitting elements mounted on the substrate, a first wavelength conversion members disposed so as to cover at least a portion of the upper surface of at least two light emitting elements of the plurality of light emitting elements, a sealing material sealing the plurality of light emitting elements and the first wavelength conversion members, and a transparent layer formed of a material different from the sealing material and is disposed between the substrate, the plurality of light emitting elements and the first wavelength conversion members, and the sealing material, wherein at least one side of each of the plurality of light emitting elements is disposed so as to face a side surface of the other light emitting element of the at least two light emitting elements, and not cover at least a portion of the non-facing side surfaces thereof.

A display device includes a plurality of first pixels and a plurality of second pixels. Each of the plurality of first pixels includes a first LED chip including a first anode and a first cathode, a second LED chip including a second anode and a second cathode, and a first transistor. One of source and drain electrodes of the first transistor is electrically connected to a first power supply voltage line. The other of the source and drain electrodes is electrically connected to the first anode and the second cathode. The first cathode and the second anode are electrically connected to a second power supply voltage line. A first potential of the first power supply voltage line is different to a second potential of the second power supply voltage line.

This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.