A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

A solar cell can include a built-in bypass diode. In one embodiment, the solar cell can include an active region disposed in or above a first portion of a substrate and a bypass diode disposed in or above a second portion of the substrate. The first and second portions of the substrate can be physically separated with a groove. A metallization structure can couple the active region to the bypass diode.

A solar cell can include a built-in bypass diode. In one embodiment, the solar cell can include an active region disposed in or above a first portion of a substrate and a bypass diode disposed in or above a second portion of the substrate. The first and second portions of the substrate can be physically separated with a groove. A metallization structure can couple the active region to the bypass diode.

A bypass diode can include a first conductive region of a first conductivity type disposed above a substrate of a solar cell and a second conductive region of a second conductivity type disposed above the first conductive region. The bypass diode can include a thin dielectric region disposed directly between the first and second conductive regions.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

A photovoltaic module comprises a back substrate having a plurality of conductive interconnects on top thereof. A conductive interconnect includes a first contact region and a second contact region. The photovoltaic module further comprises a plurality of photovoltaic cells comprising front electrodes disposed on a front surface of a photovoltaic layer on top of back electrodes on top of a support substrate. A plurality of back vias extending through the support substrate of a first cell form an electrical contact between the back electrodes and the second contact region, and a plurality of front vias extending through the support substrate, the back electrodes and the photovoltaic layer of a second cell form an electrical contact between the front electrodes and the first contact region, and is insulated from an electrical contact with the back electrodes and a P side of the photovoltaic layer.

A solar cell can include a built-in bypass diode. In one embodiment, the solar cell can include an active region disposed in or above a first portion of a substrate and a bypass diode disposed in or above a second portion of the substrate. The first and second portions of the substrate can be physically separated with a groove. A metallization structure can couple the active region to the bypass diode.

Solar cell assembly that includes at least first and second solar cells arranged adjacent each other to form a row. First electric contact pad of first solar cell is positioned adjacent to second electric contact pad of second solar cell and second electric contact pad of first solar cell is positioned adjacent to first electric contact pad of second solar cell. Interconnectors connect each first electric contact pad of first solar cell with adjacent second electric contact pad of second solar cell and each second electric contact pad of first solar cell with adjacent first electric contact pad of second solar cell. Each interconnector is sized so that, between adjacent cells, interconnector is below first electric contact pad. Cover glass is provided on a front surface of each solar cell, and each interconnector is provided with a cover member covering a front surface of interconnector.

A solar module (and its fabrication method) is presented where a supporting substrate comprises a network of finger traces connected to bus bars. Photo-active layer portions and upper electrode layer portions are deposited on the substrate thereby forming a network of cells. The cells are connected in series by connecting the bus bar of one cell to the upper electrode layer of the adjacent cell, and the bus bars of two adjacent cells are coupled through a bypass element for protecting the cell array.

The disclosure relates to a metallic interconnect member for connecting a first solar cell to a second solar cell. The interconnect member includes one or more serpentine paths having substantially perpendicular loops. The interconnect member may include two connection pads for connecting to the first solar cell. A further connection pad for connecting to a bypass diode may be included. The disclosure further relates to a string of solar cells including a first and a second solar cell connected by an interconnect member.