An active-matrix touchscreen includes a substrate, a system controller, and a plurality of spatially separated independent touch elements disposed on the substrate. Each touch element includes a touch sensor and a touch controller circuit that provides one or more sensor-control signals to the touch sensor and receives a sense signal responsive to the sensor-control signals from the touch sensor. Each touch sensor operates independently of any other touch sensor.

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.

A color conversion panel according to an exemplary embodiment of the present invention includes: a substrate; a first color filter and a second color filter adjacent to the first color filter disposed on the substrate; a first color conversion layer disposed on the first color filter; and a second color conversion layer disposed on the second color filter, wherein each of the first color conversion layer and the second color conversion layer includes at least two quantum dots representing different colors, and wherein the first color filter displays a different color from the second color filter.

A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.

A semiconductor light source that includes a substrate B and a plurality of semiconductor light-emitting rods extending respectively from the substrate, and a plurality of separating walls also extending from the substrate. The separating walls are arranged between the rods in such a way as to define groups of rods, and such that at least two separating walls have a different height.

A display apparatus includes light-emitting elements configured to emit light in a screen, a louver fixed on the screen with a fastener, and a member disposed on a surface of the louver around the fastener and configured to reflect, in multiple directions, external light incident to a portion around the fastener or absorb the external light.

A display device includes a substrate including a display area and a non-display area, and a first surface and a second surface; pixels disposed on the first surface; a signal line disposed on the first surface, and electrically connected to each pixel; a cushion layer disposed on the pixels and the signal line, and including at least one contact hole that exposes a portion of the signal line; a connector disposed in the at least one contact hole and electrically connected to the signal line; and a driver disposed on the cushion layer and electrically connected to the pixels through the connector. Each pixel includes a display element layer disposed on the first surface and including at least one light emitting element, and a pixel circuit layer disposed on the display element layer and including at least one transistor electrically connected to the at least one light emitting element.

A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

Certain aspects of the technology disclosed herein integrate a camera with an electronic display. An electronic display can include several layers, such as a cover layer, a color filter layer, a display layer including light emitting diodes or organic light emitting diodes, a thin film transistor layer, etc. A processor initiates light emission from a plurality of display elements. The processor can suspend the light emission from the plurality of display elements for a period of time imperceptible to a human observer. The processor initiates a camera to capture an image during the period of time the plurality of display elements are suspended. The processor can capture a plurality of images corresponding to a plurality of pixels and produce an image comprising depth information.

A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.