A solar cell module is discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and a plurality of first electrodes and a plurality of second electrodes, which are formed on a back surface of the semiconductor substrate and are separated from each other, the plurality of solar cells disposed in a first direction; a plurality of first conductive lines connected to the plurality of first electrodes included in a first solar cell of the plurality of solar cells, and the plurality of first conductive lines extended in the first direction; a plurality of second conductive lines connected to the plurality of second electrodes included in a second solar cell of the plurality of solar cells which is adjacent to the first solar cell, and the plurality of second conductive lines extended in the first direction.

The present invention provides a method for manufacturing a solar cell including: preparing a semiconductor silicon substrate which has an electrode, which is formed by baking an electrode precursor containing Ag powder on at least one main surface, has a PN junction, and is less than 100° C.; and performing an annealing treatment to the semiconductor silicon substrate at 100° C. or more and 450° C. or less. Consequently, there is provided the method for manufacturing a solar cell which suppresses a degradation phenomenon that an output of the solar cell is lowered when the solar cell is left as it stands at a room temperature in the atmosphere.

Embodiments of the present disclosure provide a solar cell string, a solar cell module, a manufacturing apparatus and a manufacturing method thereof. The solar cell string includes at least two solar cells including first and second solar cells adjacent to each other; front and back surfaces of each of the at least two solar cells are respectively provided with a grid line, and the grid line on the front surface is connected with the grid line on the back surface by a solder strip, the first and second solar cells have an overlapping region, and the overlapping region is provided with a buffer pad covering at least one side surface of the solder strip located in the overlapping region, and the buffer pad is formed by a pad which is pre-arranged in the overlapping region and melted at high temperature.

A solar cell panel is disclosed. The disclosed solar cell panel includes a semiconductor substrate, a conductive region disposed in or on the semiconductor substrate, an electrode connected to the conductive region, a lead electrically connected to the electrode. The electrode includes finger lines, and a bus bar line extending across the finger lines, and electrically connected to the lead. First and second end edge areas are arranged at opposite ends of the bus bar line disposed adjacent to opposite edges of the semiconductor substrate, respectively. The bus bar line includes electrode portions respectively disposed at the first end second end edge areas. Each electrode portion includes an opening formed through the each electrode portion, and an outermost end disposed at a position flush with corresponding ones of the outermost ones of the finger lines or a position outwards of the corresponding outermost finger lines.

A solar cell panel is disclosed. The disclosed solar cell panel includes a semiconductor substrate, a conductive region disposed in or on the semiconductor substrate, an electrode connected to the conductive region, a lead electrically connected to the electrode. The electrode includes finger lines, and a bus bar line extending across the finger lines, and electrically connected to the lead. First and second end edge areas are arranged at opposite ends of the bus bar line disposed adjacent to opposite edges of the semiconductor substrate, respectively. The bus bar line includes electrode portions respectively disposed at the first end second end edge areas. Each electrode portion includes an opening formed through the each electrode portion, and an outermost end disposed at a position flush with corresponding ones of the outermost ones of the finger lines or a position outwards of the corresponding outermost finger lines.

Composite making regions are provided. These masking regions can include layers or other areas of different transparency where a first region has a first transparency and a second region has a different transparency. Masking regions can be positioned between adjacent photovoltaic cells of photovoltaic arrays.

An apparatus (100) for manufacturing a photovoltaic arrangement is provided. The photovoltaic arrangement includes a conductive tab element (30) and a plurality of overlapping solar cell pieces. The apparatus includes an assembling module (300). The assembling module is configured for assembling a partial photovoltaic arrangement including a first solar cell piece (10a) and the conductive tab element. The assembling of the partial photovoltaic arrangement includes providing the first solar cell piece and the conductive tab element in an overlapping configuration. The assembling module is configured for providing a second solar cell piece (10b) and a solar cell piece of the partial photovoltaic arrangement in an overlapping configuration. The solar cell piece of the partial photovoltaic arrangement may be the first solar cell piece or a third solar cell piece (10c). Providing the second solar cell piece and the solar cell piece of the partial photovoltaic arrangement in an overlapping configuration is performed after providing the first solar cell piece and the conductive tab element in an overlapping configuration.

A back contact structure includes: a silicon substrate including a back surface including a plurality of recesses disposed at intervals; a first dielectric layer disposed on the back surface of the silicon substrate; a plurality of first doped regions disposed on the first dielectric layer and disposed inside the plurality of recesses; a plurality of second doped regions disposed on the first dielectric layer and disposed outside the plurality of recesses; a second dielectric layer disposed between the first doped regions and the second doped regions; and a conductive layer disposed on the first plurality of doped regions and the plurality of second doped regions.

A multijunction solar cell including interconnected first and second discrete semiconductor regions disposed adjacent and parallel to each other including first top solar subcell, second (and possibly third) lattice matched middle solar subcells; a graded interlayer adjacent to the last middle solar subcell; and a bottom solar subcell adjacent to said graded interlayer being lattice mismatched with respect to the last middle solar subcell; wherein an opening is provided from the bottom side of the semiconductor body to one or more of the solar subcells so as to allow a discrete electrical connector to be made extending in free space and to electrically connect contact pads on one or more of the solar subcells.

A 12th solar cell and a 13th solar cell are provided to overlap in part as viewed from a side of a light receiving surface 22. A portion of a light receiving surface of the 12th solar cell and a portion of a back surface of the 13th solar cell face each other in an overlapping portion across a wire. The overlapping portion includes a part where a resin is located both between the light receiving surface of the 12th solar cell and the wire and between the back surface of the 13th cell and the wiring member.