In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.

Provided is a light-emitting device including a light-emitting element, and a light-reflective covering member that covers the light-emitting element. The light-reflective covering member includes a light-reflective material having a plate shape, silica, and an alkali metal. The light-reflective material has a mean particle size of a range of 0.6 μm to 43 μm, and the light-reflective material has an average aspect ratio of 10 or greater.

Provided is a light-emitting device including a light-emitting element, and a light-reflective covering member that covers the light-emitting element. The light-reflective covering member includes a light-reflective material having a plate shape, silica, and an alkali metal. The light-reflective material has a mean particle size of a range of 0.6 μm to 43 μm, and the light-reflective material has an average aspect ratio of 10 or greater.

A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.

A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.

A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

A display device includes a base layer, a circuit layer on the base layer, an auxiliary pixel defining layer disposed on the circuit layer and that includes a first opening adjacent to the circuit layer and a second opening above the first opening, an inorganic protective layer disposed on the auxiliary pixel defining layer and that includes a third opening above the second opening, a pixel defining layer disposed on the inorganic protective layer and that includes a fourth opening above the third opening, a light-emitting element disposed on the circuit layer and that includes a first electrode, a functional layer disposed on the first electrode, and a second electrode disposed on the functional layer, an auxiliary electrode layer that covers the pixel defining layer and the light-emitting element, and an inorganic layer disposed on the auxiliary electrode layer and that overlaps the pixel defining layer and the light-emitting element.

A display device includes a base layer, a circuit layer on the base layer, an auxiliary pixel defining layer disposed on the circuit layer and that includes a first opening adjacent to the circuit layer and a second opening above the first opening, an inorganic protective layer disposed on the auxiliary pixel defining layer and that includes a third opening above the second opening, a pixel defining layer disposed on the inorganic protective layer and that includes a fourth opening above the third opening, a light-emitting element disposed on the circuit layer and that includes a first electrode, a functional layer disposed on the first electrode, and a second electrode disposed on the functional layer, an auxiliary electrode layer that covers the pixel defining layer and the light-emitting element, and an inorganic layer disposed on the auxiliary electrode layer and that overlaps the pixel defining layer and the light-emitting element.

A light emitting device has a substrate, a plurality of light emitting elements mounted on the substrate, a first wavelength conversion members disposed so as to cover at least a portion of the upper surface of at least two light emitting elements of the plurality of light emitting elements, a sealing material sealing the plurality of light emitting elements and the first wavelength conversion members, and a transparent layer formed of a material different from the sealing material and is disposed between the substrate, the plurality of light emitting elements and the first wavelength conversion members, and the sealing material, wherein at least one side of each of the plurality of light emitting elements is disposed so as to face a side surface of the other light emitting element of the at least two light emitting elements, and not cover at least a portion of the non-facing side surfaces thereof.

A light emitting device has a substrate, a plurality of light emitting elements mounted on the substrate, a first wavelength conversion members disposed so as to cover at least a portion of the upper surface of at least two light emitting elements of the plurality of light emitting elements, a sealing material sealing the plurality of light emitting elements and the first wavelength conversion members, and a transparent layer formed of a material different from the sealing material and is disposed between the substrate, the plurality of light emitting elements and the first wavelength conversion members, and the sealing material, wherein at least one side of each of the plurality of light emitting elements is disposed so as to face a side surface of the other light emitting element of the at least two light emitting elements, and not cover at least a portion of the non-facing side surfaces thereof.

A display device includes a first electrode, and LED chip on the first electrode, an insulating layer embeds the first electrode, contacts a side surface of the LED chip, and exposes an upper surface, a second electrode having translucency in contact with an upper surface of the insulating layer and the upper surface of the LED chip, and a first reflection control layer on an upper surface of the second electrode and having a first opening in an area overlapping with the LED chip. The first reflection control layer has a first surface on a side of the second electrode and a second surface on opposite to the first surface, and a reflectance of the first surface is higher than a reflectance of the second surface.