A semiconductor light emitting element includes: an n-type semiconductor layer made of an n-type aluminum gallium nitride (AlGaN)-based semiconductor material provided on a substrate; an active layer made of an AlGaN-based semiconductor material provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a covering layer made of a dielectric material that covers the n-type semiconductor layer, the active layer, and the p-type semiconductor layer. Each of the active layer and the p-type semiconductor layer has a sloped surface that is sloped at a first angle with respect to the substrate and is covered by the covering layer. The n-type semiconductor layer has a sloped surface that is sloped at a second angle larger than the first angle with respect to the substrate and is covered by the covering layer.

A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

A display device includes a bank including an opening defining a plurality of pixels; a plurality of light emitting elements disposed in the plurality of pixels; a color conversion layer disposed on the plurality of light emitting elements in the opening; and a low refractive layer disposed on the color conversion layer in the opening.

A display apparatus includes a substrate having a display area and a peripheral area surrounding the display area, a first initialization voltage line on the substrate, an organic film layer on the first initialization voltage line and having a first contact hole exposing at least a portion of the first initialization voltage line, and a bridge wiring on the organic film layer corresponding to the peripheral area, and in contact with the first initialization voltage line through the first contact hole, wherein the organic film layer corresponding to the peripheral area has a groove or dummy hole, each of the groove and the dummy hole being adjacent to the first contact hole.

A display apparatus includes a substrate having a display area and a peripheral area surrounding the display area, a first initialization voltage line on the substrate, an organic film layer on the first initialization voltage line and having a first contact hole exposing at least a portion of the first initialization voltage line, and a bridge wiring on the organic film layer corresponding to the peripheral area, and in contact with the first initialization voltage line through the first contact hole, wherein the organic film layer corresponding to the peripheral area has a groove or dummy hole, each of the groove and the dummy hole being adjacent to the first contact hole.

A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, a covering member, and a plurality of pairs of electrodes. The light-emitting elements are arranged in a plurality of columns and a plurality of rows. The covering member integrally covers lateral surfaces of the light-emitting elements. The pairs of electrodes are arranged at a lower surface of the light-emitting device. The pairs of electrodes include first and second pairs of electrodes aligned along a column direction so that the electrodes of the same polarity among the first and second pairs of electrodes are aligned along the column direction, and a third pair of electrodes arranged adjacent to the first pair of electrodes in a row direction so that one of the third pair of electrodes and one of the first pair of electrodes facing each other in the row direction have the same polarity.

A display device includes: a display substrate having a display area and a pad area at one side of the display area; an optical layer on the display area of a first surface of the display substrate; a circuit board on the pad area of the display substrate; and a first sealing material on the pad area of the display substrate to cover the circuit board. The circuit board has: a first portion attached to the first surface of the display substrate, a second portion bent downwardly from the first surface and attached to another surface of the display substrate, and a third portion bent between the first portion and the second portion. The first sealing material covers at least some of the first portion and the third portion.

A display device includes: a display substrate having a display area and a pad area at one side of the display area; an optical layer on the display area of a first surface of the display substrate; a circuit board on the pad area of the display substrate; and a first sealing material on the pad area of the display substrate to cover the circuit board. The circuit board has: a first portion attached to the first surface of the display substrate, a second portion bent downwardly from the first surface and attached to another surface of the display substrate, and a third portion bent between the first portion and the second portion. The first sealing material covers at least some of the first portion and the third portion.

The present disclosure provides an electronic device including a driving circuit substrate, a plurality of chips, and a passivation layer. The driving circuit substrate includes a plurality of active elements. The chips are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate. The passivation layer covers the plurality of chips and the driving circuit substrate. The passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part. The first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.