There is provided a light-emitting device (1) including: a light-emitting element (20); a light-transmissive heat dissipation member (11) having a plate shape; a wavelength conversion member (12) that takes in, from a side of a light scattering layer (12a), light that is emitted from the light-emitting element (20) and passes through the light-transmissive heat dissipation member (11), and converts a wavelength in a fluorescent layer (12b); a lateral heat dissipation member that has a plate shape, includes a high-heat conduction member (13) in contact with a side surface of the wavelength conversion member (12) via a light reflection member (14), and is in contact with an upper surface of the light-transmissive heat dissipation member (11); and a package (21) that houses the light-emitting element (20) and supports a wavelength conversion unit (100) including the light-transmissive heat dissipation member (11), the wavelength conversion member (12), and the lateral heat dissipation member.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

A display device and a tiled display are provided. The display device includes: a substrate having a display area and a non-display area which are defined thereon; a circuit element layer disposed on the substrate and including a conductive layer; an electrode layer disposed on the circuit element layer and including first and second electrodes spaced apart from each other; a light-emitting element disposed between the first electrode and the second electrode; and a dummy pattern disposed in a heat dissipation dummy area located at an edge of the display area. The dummy pattern includes a first layer and a second layer, the first layer is made of or includes a same material as the conductive layer of the circuit element layer, and the second layer is disposed above the first layer and in contact with at least a part of the first layer.

A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board.

A flexible surface lighting device is disclosed. The flexible surface lighting device includes: a flexible substrate including an upper insulating film, a lower insulating film, and a thin metal layer interposed between the upper and lower insulating films; a plurality of micro-LED chips two-dimensionally arrayed on the top surface of the flexible substrate; and a flexible light-transmitting resin part disposed on the top surface of the flexible substrate to cover the top and side surfaces of the micro-LED chips. The flexible substrate includes a white reflective layer in contact with the light-transmitting resin part on the upper insulating film.

A display device according to an embodiment includes a substrate including a plurality of holes including a hole, a metal layer disposed on one side of the substrate, a light-emitting device layer disposed on the metal layer, and a heat radiation layer disposed on another side of the substrate. The heat radiation layer contacts the metal layer in the hole.

An optoelectronic component (1) is specified having: an optoelectronic semiconductor chip (2) which generates electromagnetic radiation during operation, and a metallic layer (3) which is arranged on the semiconductor chip (2), wherein an outer surface of the metallic layer (4) has a structuring (5), identification of the component (1) is made possible by means of the structuring (5), and the metallic layer (3) is formed continuously.

Furthermore, a method for producing an optoelectronic component (1) is specified.

The invention provides an elongated luminescent body (100) comprising an elongated support (170) and a coating layer (180), wherein the elongated luminescent body (100) further comprises a body axis (BA), and a length parameter P of a body dimension perpendicular to the body axis (BA), wherein the length parameter P is selected from height (H), width (W) and diameter (D), wherein: —the elongated support (170) comprises a support material (171), a support material index of refraction n1, wherein the support material index of refraction n1 is at least 1.4, a support surface (172), and a support length (L1); —the coating layer (180) is configured on at least part of the support surface (172) over at least part of the support length (L1), wherein the coating layer (180) comprises a coating layer material (181), a coating layer index of refraction n2, wherein coating layer index of refraction n2 is at least 1.4, and a coating layer thickness (d1), wherein the coating layer material (181) has a composition different from the support material (171), wherein the coating layer material (181) comprises a luminescent material (120) configured to absorb one or more of UV radiation and visible light, and to convert into luminescent material light (8) having one or more wavelengths in one or more of the visible and the infrared; and —the support material (171) is transmissive for the luminescent material light (8), and (i) −0.2≤n1−n2≤0.2 and (ii) d1/P≤0.25 apply.

An interconnect for a semiconductor device includes: a carrier; a UV programmable chip mounted on the carrier using a first array of solder connections; a UV light source mounted on the carrier using a second array of solder connections, the UV light source being in optical communication with the UV programmable chip; and a plurality of transmission lines extending on or through the carrier and providing electrical communication between the UV programmable chip and the UV light source.

LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.