An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

A light-irradiating device of the disclosure comprises: a light-irradiating unit comprising a housing in which a light-emitting element is disposed, the housing comprising a light irradiation surface through which light from the light-emitting element can be transmitted; and a gas supply unit comprising a flow channel connected to a part of the light irradiation surface of the housing. A printing device of the disclosure comprises: the light-irradiating device mentioned above; a conveying unit which conveys a medium to be printed while causing the medium to face the light irradiation surface of the light-irradiating device; and a printing unit which is disposed adjacent to and upstream from the light-irradiating device in a conveyance direction of the medium to be printed.

A plurality of semiconductor light-emitting elements are to be efficiently cooled. There are provided a plurality of semiconductor light-emitting elements that are arranged in n rows and m columns, and a plurality of flow channels where a cooling medium flows through, the plurality of flow channels being formed to sandwich the n rows of semiconductor light-emitting elements or the m columns of semiconductor light-emitting elements.

A heat dissipation structure of the door leaf of an LED display box, comprising a box frame (100) and a box door leaf (200), a heat collection cavity (300) is simultaneously formed in the box frame (100) and on the backs of the LED display modules, when working, a number of the LED display modules are energized and emitting light, and the light is irradiated forward, and the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300), the box door leaf (200) comprises an outer door leaf plate (210) and an inner lining board (220), wherein the inner lining board (220) is arranged on the inner side (211) of the outer door leaf plate (210), and at the same time, a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210), the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300), the ventilation and heat dissipation channel (400) comprises an air inlet (410) and an air outlet (420), wherein the air inlet (410) is in communication with the heat collection cavity (300), and the air outlet (420) is arranged on the outer door leaf plate (210), the box heat source part (500) is fixedly connected to the inner side (221) of the lining board, and at the same time, the box heat source part (500) is located in the heat collection cavity (300).

A light emitting semiconductor (LES) device having desirable thermal performance characteristics is disclosed. The LES device includes an insulating substrate layer having a plurality of vias formed therein and at least one LES chip mounted on the insulating substrate layer, with each of the LES chips(s) including an active surface including a light emitting area configured to emit light therefrom and a back surface positioned on a top surface of the insulating substrate layer and including connection pads thereon. A conductor layer is positioned on a bottom surface of the insulating substrate layer and in the vias, the conductor layer in direct contact with the connection pads of the LES chip(s) so as to be electrically and thermally connected thereto. An encapsulant is positioned adjacent the top surface of the insulating substrate layer and surrounding at least part of the LES chip(s), the encapsulant comprising a light transmitting material.

A light emitting assembly comprising at least one of each of a solid state device and a thermal radiation source, couplable with a power supply constructed and arranged to power the solid state device and the thermal radiation source, to emit from the solid state device a first, relatively shorter wavelength radiation, and to emit from the thermal radiation source non-visible infrared radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and the infrared radiation, and which in exposure to said first, relatively shorter wavelength radiation, and infrared radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode and the thermal radiation device with fluorescent or phosphorescent organic and/or inorganic fluorescers and phosphors in an enclosure.

An LED device includes a multi-sided heat spreader element with a longitudinal multi-sided wall at least partly enclosing an internal space, with a plurality of LEDs mounted to the outer surface the heat spreader element, and a flow space for a cooling medium in the internal space. The tubular heat spreader element has at least one layer of a thermally conductive metal which is bendable from a flat shape to the multi-sided shape. The multi-sided shape may be tubular with a smoothly curved or multi-faceted polygonal wall. The wall of the LED device may incorporate two-phase cooling elements such as vapor chambers to maintain the LEDs at a constant temperature, and may include a temperature-controlled fan unit to control the LED temperature, and also control the wavelength and frequency of light emitted by the LEDs. A method for manufacturing the LED device is also disclosed.

Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.

A plurality of semiconductor light-emitting elements are to be efficiently cooled. There are provided a plurality of semiconductor light-emitting elements that are arranged in n rows and m columns, and a plurality of flow channels where a cooling medium flows through, the plurality of flow channels being formed to sandwich the n rows of semiconductor light-emitting elements or the m columns of semiconductor light-emitting elements.

A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.