H01L33/648

Light emitting device with LED stack for display and display apparatus having the same

A light emitting device for a display includes a substrate and first, second, and third LED sub-units, a first transparent electrode between the first and second LED sub-units and in ohmic contact with the first LED sub-unit, a second transparent electrode between the second and third LED sub-units and in ohmic contact with the second LED sub-unit, a third transparent electrode between the second transparent electrode and the third LED sub-unit and in ohmic contact with the third LED sub-unit, at least one current spreader connected to at least one of the first, second, and third LED sub-units, electrode pads disposed on the substrate, and through-hole vias formed through the substrate, in which at least one of the through-hole vias is formed through the substrate and the first and second LED sub-units.

THERMAL RADIATION BODY FOR COOLING HEATING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
20200259032 · 2020-08-13 ·

The present inventive concept relates to a thermal radiation body for cooling a heating element, which includes a pattern unit including a pore part provided as an empty space or filled with a gas phase and a cover part covering the pore part and dissipates heat of the heating element through heat radiation.

Optical and optoelectronic assembly and method for the production thereof

The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).

HEAT DISSIPATION DEVICE AND LIGHT IRRADIATION DEVICE HAVING SAME
20200240716 · 2020-07-30 · ·

Provided is a heat dissipation device capable of uniformly cooling an entire base plate (support member) without generating stress in a heat pipe. A heat dissipation device configured to dissipate heat of a heat source into the air, the heat dissipation device including: a support member disposed such that a side of a first principal surface is in close contact with a heat source; a heat pipe thermally joined to a second principal surface of the support member and configured to transport the heat from the heat source; and multiple heat radiation fins disposed in a space adjoining the second principal surface, thermally joined to the heat pipe, and configured to dissipate the heat transported by the heat pipe, in which the respective heat radiation fins are directly joined to the second principal surface in a region other than a region in which the heat pipe is mounted.

MICRO LED TRANSFER HEAD
20200220042 · 2020-07-09 ·

The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

CIRCUIT BOARD SUPPORTING STRUCTURE AND LIGHT EMITTING DEVICE HAVING THE SAME
20200214133 · 2020-07-02 · ·

Provided is a circuit board supporting structure capable of easily detaching a circuit board on a base. The circuit board supporting structure is configured to support a circuit board on a base, in which the base has a concave portion formed in a placement surface of the circuit board, and a rotational operation member configured to be rotatably accommodated in the concave portion and extend and retract in a direction perpendicular to the placement surface by a rotational operation, in which the circuit board has a through hole formed at a position corresponding to the concave portion, in which the rotational operation member has a reference surface formed approximately in parallel with the placement surface, and an operation portion formed on a rotational axis of the rotational operation member so as to be exposed from the through hole.

Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material
10697624 · 2020-06-30 ·

There are provided an apparatus for heat exchange by using a braided fabric woven from a thermally conductive wire material and a light emitting diode (LED) lighting device. The apparatus comprises a braided fabric (1) woven from a thermally conductive wire material, and a heat dissipating or absorbing object (2) is fixed with the braided fabric (1) by using methods such as welding, adhering with a thermally conductive adhesive and casting, so as to ensure that heat energy is effectively conducted between the heat dissipating or absorbing object (2) and the thermally conductive wire of the braided fabric (1), and heat is dissipated to air or absorbed from air by means of a heat dissipating surface of the thermally conductive wire of the braided fabric (1).

LIGHT ILLUMINATING APPARATUS
20200205313 · 2020-06-25 · ·

(Problem)

To provide a small light illuminating apparatus configured to uniformly cool a plurality of light emitting diodes (LEDs)

(Problem-solving approach)

A light illuminating apparatus that irradiates light of a line shape includes a light source unit having a plurality of light sources arranged along a first direction on a surface of a substrate, a heat dissipation unit having a plurality of heat sink fins formed along the first direction, and thermally coupled to an opposing surface side of the substrate, a housing which receives the heat dissipation unit and forms a wind tunnel with a cooling wind flowing inside, wherein the cooling wind cools the heat sink fins, and a first cooling fan which generates the cooling wind flowing in the first direction within the wind tunnel, wherein at least one of opposite sides of a second direction of the housing has an air hole through which the cooling wind is discharged to outside via the plurality of heat sink fins, or the cooling wind is absorbed via the plurality of heat sink fins from outside, and the wind tunnel serves as a pressure chamber in which positive pressure or negative pressure is produced by the cooling wind.

UV LED ARRAY WITH POWER INTERCONNECT AND HEAT SINK
20200194646 · 2020-06-18 ·

A heat sink and power interconnect for a UV LED array are provided. A first circuit is disposed on a surface of a first substrate. A UV LED array is positioned thereon. A second substrate and second circuit are spaced apart from the first substrate and a first heat sink is positioned adjacent thereto. An aperture passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the aperture with an electrically and thermally conductive liner positioned adjacent to the electrical insulator. A fastener is positioned in the aperture and electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply. The fastener carries one or more of a power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.

LIGHT EMITTING DEVICE WITH LED STACK FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME

A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a filler disposed between the electrode pads, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, and first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside of the light emitting device through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.