A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.

A wide bandwidth circuit board arrangement includes two coplanar substrates separated by a predetermined gap, and at least one bond wire arranged across the gap and interconnecting a respective conducting microstrip line on a first side of each respective substrate. Further, the arrangement includes at least one open stub arrangement configured on the first side of each respective substrate, each open stub arrangement comprising a microstrip extending at an angle from an end of each conducting strip on each respective substrate. Finally, the arrangement includes a ground layer on a second side of each respective substrate, and a defected ground structure arranged on the second side of each respective substrate and laterally overlapping each respective open stub arrangement arranged on the first side.

A dielectric substrate for transmitting a signal with a frequency F.sub.0 includes a dielectric and a copper film pattern arranged on a first surface of the dielectric. The copper film pattern has a first dimension L in a direction parallel to a propagation direction of an electromagnetic wave that has the frequency F.sub.0 and that propagates on the first surface, and the first dimension L is given by:

[00001]$L=\frac{1}{\sqrt{{\mathrm{.Math.}}_r}-1}.Math.k.Math..Math.{\lambda }_0$

where ε.sub.r represents a relative permittivity of the dielectric, k represents a constant in a range of 0.15 to 0.70, and λ.sub.0 represents a free space wavelength of the signal.

Systems and methods for improved chip device performance are discussed herein. An exemplary chip device for use in an integrated circuit comprises a bottom and a top opposite the bottom. The chip device comprises a through-chip device interconnect and a clearance region. The through-chip device interconnect is configured to provide an electrical connection between a ground plane trace on the bottom and a chip device path on the top of the chip device. The clearance region on the bottom of the chip device comprises an electrically conductive substance. The size and shape of the clearance region assists in impedance matching. The chip device path on the top of the chip device may further comprise at least one tuning stub. The size and shape of the at least one tuning stub also assists in impedance matching.

Described is a method for forming a planar transmission line low-pass filter and a resulting filter. The method comprises several acts, including using lithographic processes and a castable polymer with absorptive matrix as a spin-on dielectric to form the planar transmission line low-pass filter.

A ridge gap waveguide millimeter-wave crossover bridge structure device includes: an upper planar metal plate and a bottom planar metal plate arranged in parallel; a supporting structure fixedly arranged between the two planar metal plates; a ridge waveguide fixed on the upper surface of the bottom planar metal plate, with an air gap between the upper planar metal plate and the ridge waveguide; and a plurality of metal pins fixed on the upper surface of the bottom planar metal plate and evenly arranged around the ridge waveguide. The ridge waveguide includes two transmission lines arranged crosswise and four impedance transformation structures respectively connected to the ends of the two transmission lines. The distal end of each of the impedance transformation structures away from the connected transmission line is used to connect with external test equipment to be accommodated in four input ports in the bottom planar metal plate.

This application provides a gap waveguide antenna structure and an electronic device, and relates to the field of communication radars. The antenna structure includes a top layer, a gap waveguide structure, a microstrip structure, and a bottom layer. The top layer is parallel to the bottom layer. A first metal layer and a second metal layer are laid on two sides of a dielectric layer of the top layer, and the microstrip structure is disposed on the second metal layer. A frame of the microstrip structure is separated from metal of the second metal layer by leaving a space. The foregoing special antenna structure can reduce a transmission loss, improve a coupling capability, and effectively improve transmission efficiency of energy or an electromagnetic wave.

Provided are a printed circuit board configured to achieve reduction in impedance of a differential transmission line extending in a stacking direction, and an optical module. The printed circuit board includes a stacking-direction differential transmission line extending in the stacking direction, including: a differential signal via pair including a first signal via and a second signal via; and a plurality of conductor plate pairs each including a first conductor plate expanding outward from the first signal via, and a second conductor plate expanding outward from the second signal via. With respect to a perpendicular bisector of a center-of-gravity line segment connecting centers of gravity of the first and second signal vias, in each of the plurality of conductor plate pairs, centers of gravity of contours of the first and second conductor plates are located on inner sides of the centers of gravity.

A liquid crystal phase shifter is disclosed. The liquid crystal phase shifter includes a liquid crystal cell, a partition plate, a first microstrip line, a second microstrip line and liquid crystal molecules. The liquid crystal cell includes a first substrate and a second substrate disposed opposite to each other; the partition plate is disposed between the first substrate and the second substrate; the first microstrip line is disposed on a surface of the partition plate away from the second substrate; the second microstrip line is disposed on a surface of the partition plate away from the first substrate; and the liquid crystal molecules are provided between the first substrate and the partition plate, and between the second substrate and the partition plate.

An antenna unit includes a patch antenna and a case. The patch antenna includes a conductive antenna pattern and an antenna ground pattern that functions as ground of the antenna pattern and receives an electric wave. The case has dielectricity, the case being provided with the patch antenna. The antenna pattern is provided on an inner wall surface of a wall portion of the case. The antenna ground pattern is provided on an outer wall surface of a wall portion of the case and is positioned so as to face the antenna pattern.