Patent classifications
H01P3/081
MICROSTRIP MULTIPLEXER
Embodiments of the present invention disclose a microstrip multiplexer, including a feeder, multiple microstrip filters, and a signal processing network. The multiple microstrip filters are separately connected to the signal processing network, and the signal processing network is connected to the feeder. Output signals of the microstrip filters of the multiple microstrip filters are combined by using the signal processing network and then output by using the feeder and/or a signal input from the feeder is split by using the signal processing network and then output to the microstrip filters. In the embodiments of the present invention, a wideband multiplexer that combines multiple wide subband signals for using can be implemented, and each subband has good frequency band response.
Apparatus for processing radio frequency signals
Apparatus for processing radio frequency, RF, signals, wherein said apparatus comprises at least a first transmission line and a second transmission line, and an electrically conductive element that is capacitively coupled with said first transmission line and said second transmission line and that is translationally movably arranged with respect to at least one of said first transmission line and said second transmission line.
Adjustable coupling device and radio frequency communication device
The present disclosure relates to the field of communication technologies, and more particularly, to an adjustable coupling device and a radio frequency communication device. The adjustable coupling device includes a coaxial transmission line for transmitting signals across the two terminals thereof and a coupling body for sampling the signals via coupling. The adjustable coupling device further includes a coupling cavity formed on the outer surface of the coaxial transmission line; a printed circuit board on which the coupling body is disposed, the printed circuit board capping the coupling cavity to seal the coupling body within the coupling cavity; a tuner, disposed through the printed circuit board, where the lower end of the tuner extends into the coupling cavity, and the tuner can be moved up and down to change the depth thereof extended into the coupling body so as to change the electromagnetic field distribution within the coupling cavity. In this way, the present disclosure has a simple structure and thus eliminates the influence on the coupling device derived from the structure and the machining accuracy and assembly techniques of printed circuit board, with simple tuning means and high reliability.
Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line
A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.
PRINTED CIRCUIT BOARD, OPTICAL MODULE, AND TRANSMISSION EQUIPMENT
A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.
Metamaterials for surfaces and waveguides
Complementary metamaterial elements provide an effective permittivity and/or permeability for surface structures and/or waveguide structures. The complementary metamaterial resonant elements may include Babinet complements of “split ring resonator” (SRR) and “electric LC” (ELC) metamaterial elements. In some approaches, the complementary metamaterial elements are embedded in the bounding surfaces of planar waveguides, e.g. to implement waveguide based gradient index lenses for beam steering/focusing devices, antenna array feed structures, etc.
Antenna devices having frequency-dependent connection to electrical ground
Antenna devices and techniques that provide specific control of the spatial distributions of DC and RF signals at various positions in a wireless apparatus are disclosed. The wireless apparatus includes various device components each having specifications for achieving desired operations in antenna devices.
Grounding structure of high frequency circuit board
A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.
MULTILAYER SUBSTRATE
According to one embodiment, there is provided a multilayer substrate including a signal layer. The signal layer includes a first line and a second line which form a differential pair. The first line electrically connects a first node and a second node in the signal layer. The second line electrically connects a third node and a fourth node in the signal layer. The interval between the first line and the second line is approximately constant from the first node to the second node. A physical length from the third node to the fourth node in the second line is shorter than a physical length from the first node to the second node in the first line. A width of the second line is thicker than a width of the first line.
Feed network for antenna systems having microstrip conductor loops
A feed network for an antenna system having a waveguide is disclosed. The waveguide has broad sides facing each other and narrow sides facing each other. The feed network includes a first microstrip conductor including a first conductor loop and a second microstrip conductor including a second conductor loop. The first and second conductor loops each extend into the waveguide from one of the narrow sides and are each electrically coupled to one of the broad sides.