An electrical isolation apparatus. A signal is transmitted between a first transmission circuit, a first reference circuit, a second transmission circuit, and a second reference circuit according to a principle of electric field coupling between conductors. Therefore, the electrical isolation apparatus can be applied to isolation and transmission for a signal with a relatively high frequency between a first signal device and a second signal device. In addition, a material used by the electrical isolation apparatus may be a common metal conductor, which greatly reduces a size and costs of the electrical isolation apparatus and facilitates manufacturing and implementation of the electrical isolation apparatus.

A vertical combiner for an overlapping linear phased array is provided. The vertical vector combiner enables two strip-line signals from different layers to be combined, or divided, by vertical transitions between substrate layers and produce a desired output signal phase. The combiner can terminate in a short to act as an antenna. In an antenna application, the antenna provides multiple substrate layers for each strip-line signal, each having a metal ground plane. The ground planes are be coupled by vertical transitions access enabling a stepped ground within the structure which increases bandwidth. The multi-layer combiner architecture enables integration with phased array feed networks for millimeter wave phased array antennas.

A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.

A stacked-waveguide substrate includes: a body configured to include a first dielectric-substrate, a second dielectric-substrate, and a third dielectric-substrate which are stacked in this order; a first conductor-pattern configured to be formed on a bottom surface of the first dielectric-substrate; a second conductor-pattern configured to be formed on a top surface of the third dielectric-substrate in a position corresponding to the first conductor-pattern; a first conductor-film configured to be located at an interface between the first dielectric-substrate and the second dielectric-substrate, and to have a first opening which faces the first conductor-pattern; a second conductor-film configured to be located at an interface between the second dielectric-substrate and the third dielectric-substrate, and to have a second opening which faces the second conductor-pattern; a first wiring line configured to cross the first opening to the first conductor-pattern; and a second wiring line configured to cross the second opening to the second conductor-pattern.

A coupling element is disclosed, comprising four coils that are arranged such that each one of the coils extends both in a first layer and a second layer. The first layer and the second layer are stacked with respect to each other and separated by an intermediate dielectric layer. The layout of each layer is configured to provide a transformer coupling between a first one and a third one of the coils, and between a second one and a fourth one of the coils. Further, the first coil and the second coil, and the third coil and the fourth coil, respectively, are routed so as to allow a differential signaling. A semiconductor device and a differential hybrid coupler comprising the coupling element are also disclosed.

A connector assembly that provides a proper impedance connection between a CPW antenna mounted on automotive glass to a FAKRA-type connector. The connector assembly includes a PCB having a top surface and a bottom surface and being adhered to the glass. Vias are provided through the PCB to make electrical contact between metallization planes on the top surface and the bottom surface of the PCB. Terminals that are part of the connector extend through some of the vias, where ground terminals provide mechanical stability and make electrical contact with the metallization planes on the bottom surface of the PCB and a signal terminal provides an electrical connection to the antenna radiating element. The PCB is adhered to a substrate on which the antenna is mounted so that the metallization planes and microstrip lines make electrical contact with a CPW feed structure that feeds the antenna.

A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.

A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

A first ground elimination portion 3a formed in a ground layer is formed in a size such that a characteristic impedance determined by the first ground elimination portion 3a and component pads 1a is higher than a characteristic impedance determined by a ground conductor 2a and a transmission line 1b. When an outer shapes of the component pads 1a are projected on the ground layer, the center of a region interposed between the conductor pads 1a is positioned at the center of the first ground elimination portion 3a.

A vehicle pane includes a first substrate, at least one antenna structure and a connection region, wherein the antenna structure is arranged on a flexible film, wherein, additionally, a first line region is provided on the flexible film, wherein the connection region is arranged on a carrier, wherein, additionally, a second line region is provided on the carrier, wherein the flexible film has a first contact region and the carrier has a second contact region for the reciprocal connection of the first line region to the second line region, wherein the flexible film is routed around one end of the first substrate.