Transitional elements to offset a capacitive impedance in a transmission line are disclosed. Described are various examples of transitional elements in a multilayer substrate that introduce a transitional reactance to cancel the transmission line capacitive effects. The transitional elements reduce insertion loss.

A coupler comprising a silicon substrate with one or more double slot radiators configured to transmit or receive an RF signal, a slot balun circuit configured to isolate the RF signal, and a grounded coplanar waveguide configured to propagate the RF signal in a horizontal direction. The coupler can be included on an integrated chip with a second coupler and the chip can be positioned over two waveguides such that each coupler is positioned within the center of each waveguide aperture.

An electronic device comprises a waveguide block defining a cavity therein. The device has a monolithic microwave or millimetre-wave integrated circuit device positioned at least partially in the cavity. The integrated circuit device comprises a dielectric substrate and a metal foil layer that extends outwards from an external edge of the dielectric substrate. The metal foil layer and the dielectric substrate define a through hole, wherein a first edge of the through hole is an edge of the metal foil layer and defines an end of the elongate waveguide channel, and wherein the metal foil layer at least partly determines both a length and a width of an elongate waveguide channel within the cavity.

An electronic device comprises a waveguide block defining a cavity therein. The device has a monolithic microwave or millimetre-wave integrated circuit device positioned at least partially in the cavity. The integrated circuit device comprises a dielectric substrate and a metal foil layer that extends outwards from an external edge of the dielectric substrate. The metal foil layer and the dielectric substrate define a through hole, wherein a first edge of the through hole is an edge of the metal foil layer and defines an end of the elongate waveguide channel, and wherein the metal foil layer at least partly determines both a length and a width of an elongate waveguide channel within the cavity.

Embodiments of the present disclosure use a customizable ganged waveguide that comprises a top metal plate and a bottom metal plate with trenches that come together in a way so as to form waveguide channels. The waveguide assembly of the present invention also comprises a waveguide adapter affixed to a first end of the ganged waveguide and operable to conduct the signal to a tester. Further, it comprises an air barrier affixed to a second end of the ganged waveguide to prevent air from flowing from the ganged waveguide to a printed circuit board connected at the second end. Finally, it comprises a tuning plate comprising double ridge slots configured to allow maximal signal to be transferred to the printed circuit board from the ganged waveguide.

A radar system is described herein. The radar system includes a printed circuit board (PCB) that includes a metallized top layer and a substrate layer that is adjacent the metallized top layer. The substrate layer includes a substrate integrated waveguide (SIW), and the metallized layer has a slotted taper etched therein. The slotted taper is positioned relative to the SIW such that an electromagnetic signal generated by a monolithic microwave integrated circuit (MMIC) passes from the slotted taper to the SIW without an intervening microstrip line. The radar system further includes a housing that acts both to disperse heat and to suppress undesired electromagnetic radiation.

A battery pack includes a rack housing having a cabinet and a door provided to open and close the cabinet; a plurality of battery modules disposed in the cabinet in a layered form; a plurality of slave modules mounted to the battery modules one by one and having a slave antenna for wireless communication; a master module disposed at one of interlayer, top and bottom of the plurality of battery modules and having a master antenna for wireless communication; and a waveguide installed at an inner surface of the door to form a wireless communication path between the plurality of slave modules and the master module.

A waveguide includes a dielectric substrate, a first conductor layer and a second conductor layer formed on a lower surface and an upper surface thereof, a pair of side wall parts forming side walls of both sides of the waveguide, and a feed part feeding an input signal to the waveguide. The feed part includes a feed terminal formed on the lower surface of the dielectric substrate and does not contact the first conductor layer, a first via conductor connected at a lower end thereof to the feed terminal, a first connection pad connected to an upper end of the first via conductor, and second via conductors that are each connected at a lower end thereof to the first connection pad. The sum of the cross-sectional areas of the second via conductors is greater than the sum of the cross-sectional area of the first via conductor.

A waveguide includes a dielectric substrate, a first conductor layer and a second conductor layer formed on a lower surface and an upper surface thereof, a pair of side wall parts forming side walls of both sides of the waveguide, and a feed part feeding an input signal to the waveguide. The feed part includes a feed terminal formed on the lower surface of the dielectric substrate and does not contact the first conductor layer, a first via conductor connected at a lower end thereof to the feed terminal, a first connection pad connected to an upper end of the first via conductor, and second via conductors that are each connected at a lower end thereof to the first connection pad. The sum of the cross-sectional areas of the second via conductors is greater than the sum of the cross-sectional area of the first via conductor.

A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.