A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

An antenna package according to an embodiment includes a plurality of antenna units including first antenna units and second antenna units, a circuit board electrically connected to the antenna units. The circuit board includes a core layer including a first surface and a second surface facing each other, a first circuit wiring disposed on the first surface of the core layer and electrically connected to the first antenna units, and a second circuit wiring distributed on the first and second surfaces of the core layer and electrically connected to the second antenna units. Antenna units of different resonance frequencies can be efficiently included in the package using the circuit wiring design.

An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.

An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.

An antenna device includes a ground plane, a first feed via and a second feed via for penetrating the ground plane through a first hole and a second hole of the ground plane, a first feed pattern connected to the first feed via, a first antenna pattern configured to be coupled to the first feed pattern and transmit/receive an RF signal of a first frequency bandwidth, a second antenna pattern connected to the second feed via and configured to transmit/receive an RF signal of a second frequency bandwidth, and a third antenna pattern disposed between the first antenna pattern and the second antenna pattern, and overlapping the first antenna pattern and the second antenna pattern.

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

A radar device comprising: a printed circuit board (120), PCB, comprising a ground plane (1202), a radar sensor chip package (130) mounted on the PCB (120) and comprising a mm Wave radio frequency, RF, integrated circuit (1302) and a planar antenna structure (1304) configured as an antenna-in-package and oriented in a plane parallel to the ground plane (1202), wherein the mmWave RF integrated circuit (1302) is configured to output a mmWave signal (1360) to be transmitted by the planar antenna structure (1304), and a cavity (140), wherein the radar sensor chip package (130) is arranged in the cavity (140), the cavity (140) having an open side (1402), and the cavity (140) being defined by a conductive rear wall surface (1404) opposite the open side (1402), a pair of mutually opposite and conductive sidewall surfaces (1406), a conductive top surface (1408), and a conductive bottom surface (1410), wherein at least a portion of the conductive bottom surface (1410) is formed by at least a portion of the ground plane (1202) of the PCB (120), and wherein the sidewall surfaces, the top surface, and the bottom surfaces (1406, 1408,1410) each extends from the rear wall surface (1404) towards the open side (1402) of the cavity (140).

An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.

The disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4.sup.th generation (4G) communication system such as long term evolution (LTE). An electronic device including an antenna in a wireless communication system is provided. The electronic device includes a radiator, a body, and a feeding circuit for transmitting a signal, wherein the radiator is coupled to at least a part of the body, the feeding circuit is coupled to the body to support the body, and the radiator is disposed to be spaced apart from the feeding circuit to form an air gap.