Various optical systems equipped with diode laser light sources are discussed in the present application. One example system includes a diode laser light source for providing a beam of radiation. The diode laser has a spectral output bandwidth when driven under equilibrium conditions. The system further includes a driver circuit to apply a pulse of drive current to the diode laser. The pulse causes a variation in the output wavelength of the diode laser during the pulse such that the spectral output bandwidth is at least two times larger the spectral output bandwidth under the equilibrium conditions.

Device for cooling a light source, laser diode, including a first heatsink equipped with a core provided with a bore extending along a lighting axis and forming a housing for receiving such a light source, and including first fins extending from the core outward, wherein the device includes a second heatsink that has second fins extending toward the lighting axis from a peripheral portion arranged around the lighting axis, at least one second fin of the second heatsink being at least partially interleaved between first fins of the first heat sink.

An assembly (14) for analyzing a sample (15) includes a detector assembly (18); a tunable laser assembly (10); and (iii) a laser controller (10F). The detector assembly (18) has a linear response range (232) with an upper bound (232A) and a lower bound (232B). The tunable laser assembly (10) is tunable over a tunable range, and includes a gain medium (10B) that generates an illumination beam (12) that is directed at the detector assembly (18). The laser controller (10F) dynamically adjusts a laser drive to the gain medium (10B) so that the illumination beam (12) has a substantially constant optical power at the detector assembly (18) while the tunable laser assembly (10) is tuned over at least a portion of the tunable range.

An optical module control method is a method for controlling an optical module that includes a semiconductor light emitting element and an electronic cooling module configured to adjust a temperature of the semiconductor light emitting element. The optical module control method includes a step of detecting a temperature of a light emitting unit including the semiconductor light emitting element, and outputting temperature information of the semiconductor light emitting element; a step of detecting an environmental temperature and outputting temperature information of the environmental temperature, the environmental temperature being a temperature of environment where the light emitting unit is placed; and a step of controlling an output of the electronic cooling module on the basis of the temperature information of the semiconductor light emitting element and the temperature information of the environmental temperature, and adjusting the temperature of the light emitting unit.

An optical system includes a plurality of lenses and a lens holding member. Each of the plurality of lenses has a cut-off face to have a shape of a partial circle formed by cutting off part of a periphery of a first circle. Cut-off faces of adjacent lenses face each other. The adjacent lenses have an interval between centers of the lenses is smaller than a diameter of the first circle. The lens holding member has an outer surface including a plurality of lens arrangement holes in which the plurality of lenses are respectively disposed. Adjacent lens arrangement holes are linked together to form a linked hole. The linked hole has a shape that represents part of a shape formed by disposing a plurality of second circles, the second circles being partially overlapped, each of the second circles having a diameter larger than a diameter of the first circle.

The present disclosure relates to a 3D printer having a cooling function, The 3D printer includes: a tank configured to store therein a photocurable liquid resin; a bed configured to support a shaping object; a bed transfer unit configured to move the bed in a vertical direction; a light projection unit configured to linearly project laser light to the photocurable liquid resin stored in the tank so as to cure the photocurable liquid resin into a shaping object; a light projection unit transfer unit configured to move the light projection unit; a control unit configured to control operations of the light projection unit, the light projection unit transfer unit, and the bed transfer unit; and a cooling unit configured to dissipate heat generated from the light projection unit.

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.

The diode laser comprises a laser bar having a semiconductor body and an active layer, wherein the laser bar has a plurality of individual emitters. At least some individual emitters are respectively assigned a section of the semiconductor body and a current regulating element connected in series therewith, such that, during operation of the individual emitters as intended, an electrical operating current I.sub.0 fed to the individual emitter in each case flows completely through the assigned section of the semiconductor body and in the process a voltage drop U.sub.H occurs at the section and at least part of said operating current I.sub.0 flows through the assigned current regulating element and experiences an electrical resistance R.sub.S in the process. In the case of the individual emitters, the current regulating element assigned in each case is configured such that the resistance Rg at an operating temperature T.sub.0 has a positive temperature coefficient dR.sub.S/dT|.sub.T0. Alternatively or additionally, the resistance R.sub.S is greater than |?U.sub.H/I.sub.0, wherein ?U.sub.H is the change in the voltage drop U.sub.H at the assigned section of the semiconductor body in the event of an increase in the temperature T of the individual emitter from an operating temperature T.sub.0 by 1 K.

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

In a laser apparatus, transmission of vibration, which is generated in a portion that generates a cooling gas flow, to a laser unit is suppressed, and heat generated from the laser unit is efficiently dissipated. A laser unit is housed inside a box-shaped housing having a plurality of faces. A frame supports a laser unit with a first mount interposed therebetween inside the housing. The frame has a through-hole penetrating from one face side to the other face side. A blower fan generates a flow of cooling gas for cooling the laser unit. The blower fan is attached to, for example, a second housing so as to face the laser unit. The cooling gas moves through the through-hole of the frame between the blower fan and the laser unit.