An optical transmitter includes a semiconductor laser, a thermoelement that is connected with the semiconductor laser and that heats or cools the semiconductor laser, a thermistor that detects the temperature of the semiconductor laser via the thermoelement, a laser drive circuit that drives the semiconductor laser, a thermoelement driving circuit that acquires information about the temperature of the semiconductor laser from the thermistor, and that controls a current flowing through the thermoelement in such a way that the temperature detected by the thermistor becomes equal to a set value, and a controller that varies the set value on the basis of monitor current information outputted from the semiconductor laser, the temperature information about the semiconductor laser which is notified from the thermistor, and laser driving current information notified from the laser drive circuit.

A laser weapon system is described. Particularly, embodiments describe subsystems of a laser weapon system including those necessary for laser generation, operational control, optical emission, and heat dissipation configured to provide a lightweight unit of reduced dimensions.

Device for cooling a light source, laser diode, including a first heatsink equipped with a core provided with a bore extending along a lighting axis and forming a housing for receiving such a light source, and including first fins extending from the core outward, wherein the device includes a second heatsink that has second fins extending toward the lighting axis from a peripheral portion arranged around the lighting axis, at least one second fin of the second heatsink being at least partially interleaved between first fins of the first heat sink.

Various optical systems equipped with diode laser light sources are discussed in the present application. One example system includes a diode laser light source for providing a beam of radiation. The diode laser has a spectral output bandwidth when driven under equilibrium conditions. The system further includes a driver circuit to apply a pulse of drive current to the diode laser. The pulse causes a variation in the output wavelength of the diode laser during the pulse such that the spectral output bandwidth is at least two times larger the spectral output bandwidth under the equilibrium conditions.

Disclosed are a manufacturing method for a laser chip and a laser chip. The manufacturing method comprises: step S1, forming a first electroplating substrate on an epitaxial layer; step S2, forming an organic pattern layer on the first electroplating substrate, wherein the pattern layer defines a hollowed-out area and a part of the first electroplating substrate is exposed to the pattern layer by means of the hollowed-out area; step S3, forming a first metal coating on the first electroplating substrate, wherein the first metal coating completely covers the pattern layer and the part of the first electroplating substrate not covered by the pattern layer; and step S4, removing the pattern layer to have a hollow channel formed between the first metal coating and the first electroplating substrate, wherein the channel is provided with at least one inlet and at least one outlet running through the first metal coating.

An optical module includes a light forming part and a protective member that has an emitting window transmitting light from the light forming part and is disposed to surround the light forming part. The light forming part 20 includes a base member, a semiconductor light-emitting element mounted on the base member, a lens mounted on the base member, and the first supporting member that is disposed between the base member and the lens and supports the lens with respect to the base member. The first supporting member has constriction, which has a smaller cross-sectional area than a region in which the first supporting member is in contact with the lens and a region in which the first supporting member is in contact with the base member in a cross section perpendicular to a thickness direction of the first supporting member.

An optical module includes a light forming part and a protective member that has an emitting window transmitting light from the light forming part and is disposed to surround the light forming part. The light forming part 20 includes a base member, a semiconductor light-emitting element mounted on the base member, a lens mounted on the base member, and the first supporting member that is disposed between the base member and the lens and supports the lens with respect to the base member. The first supporting member has constriction, which has a smaller cross-sectional area than a region in which the first supporting member is in contact with the lens and a region in which the first supporting member is in contact with the base member in a cross section perpendicular to a thickness direction of the first supporting member.

An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

To provide a laser device allowing the prevention of dew formation on a cooler of the laser device, while contributing to a longer lifetime of a humidity sensor to be used. A laser device includes a laser diode and a cooler for cooling the laser diode. The laser diode and the cooler are provided in a housing. The laser device includes: a humidity detector that detects humidity in the laser device while current is applied to the humidity detector; and a current application controller that controls the time of current application to the humidity detector. In one aspect of the laser device, the laser device further includes: a temperature detector that detects a temperature in the housing; and a dew point calculator that calculates a dew point based on the humidity detected by the humidity detector, and the temperature detected by the temperature detector. The current application controller controls the time of current application to the humidity detector based on the dew point calculated by the dew point calculator.

To provide a laser device allowing the prevention of dew formation on a cooler of the laser device, while contributing to a longer lifetime of a humidity sensor to be used. A laser device includes a laser diode and a cooler for cooling the laser diode. The laser diode and the cooler are provided in a housing. The laser device includes: a humidity detector that detects humidity in the laser device while current is applied to the humidity detector; and a current application controller that controls the time of current application to the humidity detector. In one aspect of the laser device, the laser device further includes: a temperature detector that detects a temperature in the housing; and a dew point calculator that calculates a dew point based on the humidity detected by the humidity detector, and the temperature detected by the temperature detector. The current application controller controls the time of current application to the humidity detector based on the dew point calculated by the dew point calculator.