A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

A light emitting device includes a wiring board having a first wiring layer and a second wiring layer adjacent to the first wiring layer via an insulating layer, and a laser having a cathode electrode and an anode electrode, mounted on the wiring board, and driven through low-side driving. The first wiring layer includes a cathode wire connected to the cathode electrode, an anode wire connected to the anode electrode, and a first reference potential wire connected to a reference potential. The second wiring layer includes a second reference potential wire connected to the reference potential. An area of an overlap between the second reference potential wire and the anode wire is larger than an area of an overlap between the second reference potential wire and the first reference potential wire.

A light source device includes: first and second laser diodes; a reflector having: first and second reflecting faces configured to reflect a portion of light from the respective first and second laser diodes and to transmit a portion of the light from the respective first and second laser diodes, and first and second exit faces configured to allow the portions of the light transmitted through the respective first and second reflecting faces to exit; and a photodetector including: first and second light receiving element configured to receive light exiting the first and second exit faces, respectively. The reflector is configured such that the light transmitted through the first reflecting face is hindered from exiting the second exit face and the light transmitted through the second reflecting face is hindered from exiting the first exit face.

In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.

Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.

An optoelectronic component (1) is specified having: an optoelectronic semiconductor chip (2) which generates electromagnetic radiation during operation, and a metallic layer (3) which is arranged on the semiconductor chip (2), wherein an outer surface of the metallic layer (4) has a structuring (5), identification of the component (1) is made possible by means of the structuring (5), and the metallic layer (3) is formed continuously.

Furthermore, a method for producing an optoelectronic component (1) is specified.

A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.

An adapter element (10) for connecting a component (4), such as a laser diode, to a heat sink (7), comprising: a first metal layer (11), which in a mounted state faces the component (4), and a second metal layer (12), which in the mounted state faces the heat sink (7), and an intermediate layer (13) comprising ceramic arranged between the first metal layer (11) and the second metal layer (12), wherein the first metal layer (11) and/or the second metal layer (12) is thicker than 40 μm, preferably thicker than 70 μm and more preferably thicker than 100 μm.

The present invention relates to an assembly of a temperature regulating device for a semiconductor laser.

The essence of the present invention is that a flat thermally conductive surface of said device is used as a thermally conductive base surface, the assembly further contains two fixing plates which are rigidly fastened to said thermally conductive base surface and adjoin the opposite lateral sides of a lower thermally insulated surface of a thermoelectric element, said surface being in contact with the thermally conductive base surface to prevent the longitudinal and transverse displacements of the thermoelectric element along the thermally conductive base surface, and a thermally conductive plate is rigidly fastened to the thermally conductive base surface and is thermally insulated therefrom.

A method is disclosed for mounting and cooling a circuit component having aplurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive and electrically insulating material with a circuit board arranged between the circuit component and the substrate. The circuit board, which has a flexible base and carries conductive traces that terminate in contact pads, is secured to the rigid substrate with at least some of the contact pads on the circuit board disposed on the side of the circuit board facing the rigid substrate, at least some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the flexible base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate. The side of the contact pads exposed by the holes is plated to form conductive vias that fill the holes and that are soldered to the contacts of the circuit component.