According to one embodiment, a light source includes a plurality of light-emitting elements each including one or more surface-emitting lasers; and a plurality of detecting elements located on a same substrate as the light-emitting elements. The detecting elements individually detect quantities of output light of the light-emitting elements.

A semiconductor device includes a substrate, an epitaxial stack disposed on the substrate, a first connection layer between the epitaxial stack and the substrate and a first electrode disposed on the first connection layer. The substrate has a first side surface and a second side surface. The epitaxial stack has a semiconductor structure with a first lateral surface adjacent to the first side surface and a second lateral surface opposing the first lateral surface and adjacent to the second side surface. The first connection layer has a first protruding portion extending beyond the first lateral surface and a second protruding portion extending beyond the second lateral surface. The first electrode is in contact with the first protruding portion and the second protruding portion.

A multilayer interconnect is described which enables electrically connecting a complex distribution of VCSEL or other light emitter elements in a large high density addressable array. The arrays can include many groups of VCSEL elements interspersed among each other to form a structured array. Each group can be connected to a contact pad so that each group of light emitter elements can be activated separately.

A projector assembly includes three coaxially aligned lenses and an aperture stop. The three coaxially aligned lenses include a first lens and, in order of increasing distance therefrom and on a same side thereof, a second lens and a positive meniscus lens. The first lens is a positive lens. The second lens is a negative lens. The second lens is located between the aperture stop and the positive meniscus lens. The projector assembly is one-sided telecentric at a plane proximate the positive meniscus lens.

A plurality of surface emitting lasers are formed on the single surface emitting laser element. The plurality of surface emitting lasers have respective emission wavelengths selected from wavelengths satisfying condition of:
0<λ.sub.1−λ.sub.s≤5.36×10.sup.−5λ.sub.c.sup.2−×5.83×10.sup.−2λ.sub.c+32.4 where a first emission wavelength is λ.sub.1 [nm], a second emission wavelength shorter than the first emission wavelength is λ.sub.s [nm], and a middle wavelength between the first emission wavelength and the second emission wavelength is λ.sub.c [nm]. At least one of the plurality of surface emitting lasers has an emission wavelength different from an emission wavelength of another surface emitting laser.

A light-emitting module includes a substrate, a first surface-emitting laser mounted on the substrate, the first surface-emitting laser having a first engaging portion protruded outward at an end, and a second surface-emitting laser mounted on the substrate, the second surface-emitting laser having a second engaging portion recessed inward at an end. The first surface-emitting laser and the second surface-emitting laser are adjacent to each other. The first engaging portion and the second engaging portion are engaged with each other.

The invention relates to a semiconductor laser apparatus having a layer stack which comprises a first resonator mirror, a second resonator mirror and an active zone which is arranged between the first and second resonator mirrors and which is suitable for emitting electromagnetic radiation. A charge carrier barrier is arranged around a central region of the active zone.

An optical assembly comprising a busbar system comprising an electrically conductive first busbar conductively coupled to one or more electrically conductive mechanical fasteners and one or more vertical-cavity surface-emitting laser (VCSEL) array modules each comprising one or more electrically conductive contacts. Each VCSEL array module is releasably fastened to the busbar system by the one or more of the mechanical fasteners. When in a fastened position, the one or more mechanical fasteners are conductively coupled to the one or more electrically conductive contacts to provide an electrical connection between the first busbar and the one or more VCSEL array modules.

There are provided a surface emission laser 10, a surface emission laser array in which the surface emission laser 10 is arrayed two-dimensionally, and a surface emission laser manufacturing method that enable efficient injection of a current to an active layer 200b, while suppressing deterioration of the crystallinity of layers stacked above a contact area.

The present technology provides a surface emission laser 10 including a substrate 100, and a mesa structure 200 formed on the substrate 100, in which the mesa structure 200 includes at least a part of a first multilayer film reflector 200a stacked on the substrate 100, an active layer 200b stacked on the first multilayer film reflector 200a, and a second multilayer film reflector 200c stacked on the active layer 200b, and an impurity area 800 is provided over a contact area CA that is adjacent to the mesa structure 200, and contacts an electrode 600, and a side wall section of a portion of the mesa structure 200 which portion includes the first multilayer film reflector 200a.

A cap is mounted to a support substrate, the cap including a cap body and an optical shutter. The cap and support substrate define a housing. An electronic chip is disposed in the housing above the support substrate. A face of the electronic chip supports an optical device that is optically coupled with the optical shutter. The cap body is thermally conductive. Within the housing, a thermally conductive linking structure is coupled in a thermally conductive manner between the cap body and the electronic chip. The thermally conductive linking structure surrounds the electronic chip. A thermal interface material fills a portion of the housing between the thermally conductive linking structure and the cap body.