A self-biased amplifier includes a capacitor, a bias generation circuit and a common source amplifier. The capacitor is used to receive an input voltage and output an alternating component of the input voltage. The bias generation circuit is coupled to the capacitor, and used to generate a first bias voltage according to the alternating component. The common source amplifier is coupled to the bias generation circuit, and used to generate an amplified voltage according to the first bias voltage.

A communication unit includes a plurality of parallel radio frequency, RF, signal paths. Located between a first RF signal path of the plurality of parallel RF signal paths comprising at least one first RF amplifier and a second signal path comprising at least one second RF amplifier is one of a shared inductor or shared transformer. The at least one first RF amplifier is coupled to a supply voltage via a first switch and at least one second RF amplifier is coupled to the supply voltage via a second switch, and the first switch is closed that provides the supply voltage to the at least one second RF amplifier whilst the second switch is opened.

A communication unit includes a plurality of parallel radio frequency, RF, signal paths. Located between a first RF signal path of the plurality of parallel RF signal paths comprising at least one first RF amplifier and a second signal path comprising at least one second RF amplifier is one of a shared inductor or shared transformer. The at least one first RF amplifier is coupled to a supply voltage via a first switch and at least one second RF amplifier is coupled to the supply voltage via a second switch, and the first switch is closed that provides the supply voltage to the at least one second RF amplifier whilst the second switch is opened.

A multi-stage radio frequency power amplifier (RFPA) includes an output stage SMPA and a driver stage SMPA. As the multi-stage RFPA operates, the magnitude of an RF switch drive signal generated by the driver stage SMPA is dynamically minimized based on I-V characteristic curves of the output stage SMPA's power transistor and the output stage SMPA's dynamically changing load line. By constraining the magnitude of the RF switch drive signal as the multi-stage RFPA operates, VGS feedthrough of the RF switch drive signal is minimized, to the extent possible. Amplitude distortion and phase distortion in the RF output that might occur due to unconstrained VGS feedthrough, particularly at low output RF power levels, are therefore avoided. Operating all stages of the multi-stage RFPA in switch mode also results in high energy efficiency and an output RF spectrum with very low wideband noise (WBN).

A multi-stage radio frequency power amplifier (RFPA) includes an output stage SMPA and a driver stage SMPA. As the multi-stage RFPA operates, the magnitude of an RF switch drive signal generated by the driver stage SMPA is dynamically minimized based on I-V characteristic curves of the output stage SMPA's power transistor and the output stage SMPA's dynamically changing load line. By constraining the magnitude of the RF switch drive signal as the multi-stage RFPA operates, VGS feedthrough of the RF switch drive signal is minimized, to the extent possible. Amplitude distortion and phase distortion in the RF output that might occur due to unconstrained VGS feedthrough, particularly at low output RF power levels, are therefore avoided. Operating all stages of the multi-stage RFPA in switch mode also results in high energy efficiency and an output RF spectrum with very low wideband noise (WBN).

A power amplifier module includes an amplifier that amplifies an input signal and outputs the amplified signal, a harmonic termination circuit that is disposed subsequent to the amplifier and that attenuates a harmonic component of the amplified signal, the harmonic termination circuit including at least one field effect transistor (FET), and a control circuit that controls a gate voltage of the at least one FET to adjust a capacitance value of a parasitic capacitance of the at least one FET. The control circuit adjusts the capacitance value of the parasitic capacitance of the at least one FET, and thereby a resonance frequency of the harmonic termination circuit is adjusted.

A power amplifier module includes an amplifier that amplifies an input signal and outputs the amplified signal, a harmonic termination circuit that is disposed subsequent to the amplifier and that attenuates a harmonic component of the amplified signal, the harmonic termination circuit including at least one field effect transistor (FET), and a control circuit that controls a gate voltage of the at least one FET to adjust a capacitance value of a parasitic capacitance of the at least one FET. The control circuit adjusts the capacitance value of the parasitic capacitance of the at least one FET, and thereby a resonance frequency of the harmonic termination circuit is adjusted.

In one example, a circuit includes a first node to receive an analog signal that is an amplitude modulated radio-frequency signal for a digital signal. An output node is configured to provide an output signal indicative of rising and falling edges of an envelope of the analog signal. The rising and falling edges are indicative of rising and falling edges of the digital signal. A first current path is disposed between a power supply node and the first node. The first current path includes a first transistor coupled between the first node and a first bias source. The first bias source is coupled between the first transistor and the power supply node. The output node is coupled to a first intermediate node in the first current path between the transistor and the first bias source. A control terminal of the first transistor is coupled to the output node via a feedback network.

Monolithic microwave integrated circuits are provided that include a substrate, a transmit/receive selection device that is formed on the substrate, a high power amplifier formed on the substrate and coupled to a first RF port of the transmit/receive selection device, a low noise amplifier formed on the substrate and coupled to a second RF port of the transmit/receive selection device and a protection circuit that is coupled to a first control port of the transmit/receive selection device.

Monolithic microwave integrated circuits are provided that include a substrate, a transmit/receive selection device that is formed on the substrate, a high power amplifier formed on the substrate and coupled to a first RF port of the transmit/receive selection device, a low noise amplifier formed on the substrate and coupled to a second RF port of the transmit/receive selection device and a protection circuit that is coupled to a first control port of the transmit/receive selection device.