A radio frequency power amplifier with harmonic control circuit as well as method for manufacturing the same are disclosed. According to an embodiment, a radio frequency power amplifier includes: a planar dielectric substrate, a first conductive layer and a second conducting layer. The first conductive layer is disposed on a first side of the planar dielectric substrate. The second conducting layer is disposed on a second side of the planar dielectric substrate. The first conductive layer has a pattern comprising one or more harmonic control circuits. The second conductive layer acts as a ground plane. The second side of the planar dielectric substrate is opposite to the first side of the planar dielectric substrate.

Some embodiments herein describe a radio frequency power semiconductor device that include a first non-linear filter network for compensating for lower frequency noise of a power amplifier. The first non-linear filter network can include a plurality of infinite impulse response filters and corresponding corrective elements to correct for a non-linear portion of the power amplifier. The radio frequency power semiconductor device can further include a second non-linear filter network for compensating for broadband distortion. The second non-linear filter network can be connected in parallel to the first non-linear filter network. The broadband distortion can include digital predistortion and the narrowband distortion can include charge trapping effects. The first non-linear filter network can comprise Laguerre filters. The second non-linear filter network can comprise general memory polynomial filters.

A power amplifier module includes a first transistor that amplifies and outputs a signal, a second transistor that supplies a bias current to a base of the first transistor, and a ballast resistor circuit that is disposed between the base and an emitter of the second transistor and that includes first and second resistive elements and a switching element. The first resistive element is arranged in series on a line connecting the base and the emitter. The first and second resistive elements are series-connected or parallel-connected. When the second resistive element is series-connected to the first transistor, the switching element is parallel-connected to the second resistive element. When the second resistive element is parallel-connected to the first transistor, the switching element is series-connected to the second resistive element. The switching element is switched on/off based on a collector current of the second transistor.

RF transistor amplifiers include an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure and a plurality of gate terminals, a plurality of drain terminals, and at least one source terminal that are each on an upper surface of the semiconductor layer structure, an interconnect structure on an upper surface of the RF transistor amplifier die, and a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the gate terminals, the drain terminals and the source terminal to the interconnect structure.

The present disclosure relates to added isolation between transistors in a multiple path amplifier circuit. The multiple path amplifier circuit includes a substrate, a first transistor on the substrate in a first path, and a second transistor on the substrate in a second path. The multiple path amplifier circuit also includes at least one electrical connection associated with the first and the second transistors and positioned to at least partially extend between the first path and the second path.

The present disclosure relates to added isolation between transistors in a multiple path amplifier circuit. The multiple path amplifier circuit includes a substrate, a first transistor on the substrate in a first path, and a second transistor on the substrate in a second path. The multiple path amplifier circuit also includes at least one electrical connection associated with the first and the second transistors and positioned to at least partially extend between the first path and the second path.

A Doherty amplifier includes a peaking amplifier, a carrier amplifier, and a combining node electrically connected to the carrier amplifier and the peaking amplifier. The Doherty amplifier includes a harmonic control circuit coupled to the combining node. The harmonic control circuit includes an inductor and a capacitor and the inductor and capacitor are connected in series between the first current conducting terminal and a ground reference node. An inductance value of the inductor of the harmonic control circuit and a capacitance value of the capacitor of the harmonic control circuit are selected to terminate second order harmonic components of a fundamental frequency of a signal generated by the carrier amplifier.

An application specific integrated circuit (ASIC) can drive semiconductor devices, such as, radio frequency amplifiers, switches, etc. The ASIC can include a supply and reference voltage generation circuit, a digital core, a clock generator, a plurality of analog-to-digital converters, low and high-speed communications interfaces, drain and gate sensing circuits (that can include one or more current sense amplifiers), and a gate driver circuit. The ASIC can be a low voltage semiconductor integrated circuit.

An application specific integrated circuit (ASIC) can drive semiconductor devices, such as, radio frequency amplifiers, switches, etc. The ASIC can include a supply and reference voltage generation circuit, a digital core, a clock generator, a plurality of analog-to-digital converters, low and high-speed communications interfaces, drain and gate sensing circuits (that can include one or more current sense amplifiers), and a gate driver circuit. The ASIC can be a low voltage semiconductor integrated circuit.

An envelope tracking (ET) integrated circuit (ETIC) operable with multiple types of power amplifiers is provided. The ETIC is configured to provide one or more ET voltages to a power amplifier(s) for amplifying a radio frequency (RF) signal. In embodiments disclosed herein, the ETIC can be configured to generate the ET voltages at same or different voltage levels based on specific types of the power amplifier(s), such as multi-stage power amplifier and Doherty power amplifier, and for a wider modulation bandwidth of the RF signal. As such, the ETIC can be flexibly adapted to enable a variety of power management scenarios and/or topologies.