Patent classifications
H03F3/211
RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, RADIO FREQUENCY CIRCUIT, AND TRACKER MODULE
A radio frequency module is provided that includes a plurality of power amplifiers, an external connection terminal, a filter, and a switch. The amplifiers include a first power amplifier and a second power amplifier. The external connection terminal is connected to a tracker component configured to supply a power supply voltage to the power amplifiers. Moreover, the filter is not disposed on a first path between the external connection terminal and the first power amplifier, but instead it is disposed on a second path between the external connection terminal and the second power amplifier. The switch is configured to switch connection to the external connection terminal between the first path and the second path.
THREE-WAY COMBINED RF POWER AMPLIFIER ARCHITECTURE
Systems and methods for amplifying a signal is described. A circuit may convert an input radio frequency (RF) signal into a first RF signal with power level matching a power capacity of a first transistor of a first size in a carrier amplifier stage, a second RF signal with power level matching a power capacity of a second transistor of the first size in a peaking amplifier stage, and a third RF signal with third power level matching a power capacity of a third transistor of a second size in another peaking amplifier stage. The circuit may amplify the first, second, and third RF signals to generate first, second, and third amplified RF signals, respectively. The circuit may combine the first, second, and third amplified RF signals, into an output RF signal that is an amplified version of the input RF signal.
POWER AMPLIFIER CIRCUIT AND DIFFERENTIAL POWER AMPLIFIER CIRCUIT
A first transistor having a base or a gate supplied with a high-frequency signal through a capacitor, and supplied with a bias current through a resistive element, a second transistor having a base or a gate connected to an emitter or a source of the first transistor, and a collector or a drain connected to an output terminal, and a third transistor having a collector or a drain connected to the base or the gate of the first transistor, and an emitter or a source connected to reference potential are provided, and the third transistor is provided such that a current flowing through the collector or the drain of the third transistor increases when a current flowing through the collector or the drain of the second transistor increases.
Providing a constant impedance at an input of a signal amplifier for different gain modes
Disclosed herein are methods for use in operating signal amplifiers that provide impedance adjustments for different gain modes. The impedance adjustments are configured to result in a constant real impedance for an input signal at the amplifier. Some of the disclosed methods adjust impedance using switchable inductors to compensate for changes in impedance with changing gain modes. Some of the disclosed methods adjust a device size to compensate for changes in impedance with changing gain modes. By providing impedance adjustments, the amplifiers reduce losses and improve performance by improving impedance matching over a range of gain modes.
Drain sharing split LNA
A receiver front end (300) having low noise amplifiers (LNAs) is disclosed herein. A cascode having a “common source” configured input FET and a “common gate” configured output FET can be turned on or off using the gate of the output FET. A first switch (235) is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. A drain switch (260) is provided between the drain terminals of input FETs to place the input FETs in parallel. This increases the g.sub.m of the input stage of the amplifier, thus improving the noise figure of the amplifier.
Power amplifier module, frontend circuit, and communication device
A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.
Method and system for linear signal processing with signal decomposition
There is provided a method and system for linear signal processing with signal decomposition. The system including: a decomposition module to receive an analog input signal and perform signal decomposition, the signal decomposition including slicing the analog input signal into a plurality of slices to produce one or more analog components and one or more digital components, the decomposition module directing each component to a separate signal path; and a processing module to perform one or more linear operations on at least one of the signal paths. In some cases, the signal decomposition includes slicing the analog input signal into the plurality of slices by amplitude. In some cases, the analog components include unsaturated slices of the analog input signal and the digital components include saturated slices of the analog input signal.
RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array
Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.
POWER SUPPLY MODULATION DEVICE, POWER SUPPLY MODULATION METHOD, AND POWER SUPPLY MODULATION-TYPE AMPLIFIER
A power supply modulation device includes a unit detecting, from a first digital signal, a first amplitude being the amplitude of a first analog signal provided to a first amplifier and detecting, from a second digital signal, a second amplitude being the amplitude of a second analog signal provided to a second amplifier; a unit that calculates a time differential value of a ratio of the first amplitude to a sum of the first amplitude and the second amplitude, and determines, on the basis of the time differential value, whether or not output impedance of a combining circuit that combines together the first analog signal amplified and the second analog signal changes along with a change in power of the combined signal; and a unit that controls a power supply voltage supplied to each of the first amplifier and the second amplifier, on the basis of the determination.
OUTPUT STAGE CIRCUIT ASSEMBLY FOR POWER AMPLIFIER SYSTEM WITH IMPROVED POWER MANAGEMENT
Examples of the disclosure include an output stage circuit assembly for a power amplifier system, the output stage circuit assembly comprising a plurality of output stage amplifiers connected in parallel to each other, each output stage amplifier of the plurality of output stage amplifiers configured to amplify an input signal of the output stage circuit assembly when turned on, and a controller configured to determine a number of output stage amplifiers to be turned off based on at least one of a voltage supplying mode for the power amplifier system or a power management mode of a device in which the power amplifier system is embedded, and to control the plurality of output stage amplifiers to be turned on or off according to the determined number of output stage amplifiers to be turned off.