An aspect of the disclosure relates to an apparatus including an output driver, including: a first p-channel metal oxide semiconductor field effect transistor (PMOS FET); a second PMOS FET coupled in series with the first PMOS FET between an upper voltage rail and an output; a first n-channel metal oxide semiconductor field effect transistor (NMOS FET); and a second NMOS FET coupled in series with the first NMOS FET between the output and a lower voltage rail; a first predriver coupled to gates of the first and second PMOS FETs and first and second NMOS FETs; and a second predriver coupled to the gates of the first and second PMOS FETs and first and second NMOS FETs.

A circuit includes a high-side switch and a low-side switch. A first inverter includes first and second discharge current paths activatable to sink first and second discharge currents, respectively, from the control terminal of the high-side switch. A second inverter includes first and second charge current paths activatable to source first and second charge currents to the control terminal of the low-side switch. A high-side sensing current path includes an intermediate high-side control node, and a low-side sensing current path includes an intermediate low-side control node. The second discharge current path is selectively enablable in response to a high-side detection signal at the intermediate high-side control node having a high logic value, and the second charge current path is selectively enablable in response to a low-side detection signal at the intermediate low-side control node having a low logic value.

A circuit includes a high-side switch and a low-side switch. A first inverter includes first and second discharge current paths activatable to sink first and second discharge currents, respectively, from the control terminal of the high-side switch. A second inverter includes first and second charge current paths activatable to source first and second charge currents to the control terminal of the low-side switch. A high-side sensing current path includes an intermediate high-side control node, and a low-side sensing current path includes an intermediate low-side control node. The second discharge current path is selectively enablable in response to a high-side detection signal at the intermediate high-side control node having a high logic value, and the second charge current path is selectively enablable in response to a low-side detection signal at the intermediate low-side control node having a low logic value.

An input circuit includes an input buffer circuit using a first node as an input and a second node as an output, an N-type transistor having a source coupled to the input terminal, a drain coupled to the first node, and a gate coupled to a power supply, and a pull-up circuit provided between the first node and the power supply. The pull-up circuit is configured to make the power supply and the first node conducive with each other for a predetermined period when the input signal transitions from low to high and not to make the power supply and the first node conductive with each other when the input signal transitions from high to low.

An input circuit includes an input buffer circuit using a first node as an input and a second node as an output, an N-type transistor having a source coupled to the input terminal, a drain coupled to the first node, and a gate coupled to a power supply, and a pull-up circuit provided between the first node and the power supply. The pull-up circuit is configured to make the power supply and the first node conducive with each other for a predetermined period when the input signal transitions from low to high and not to make the power supply and the first node conductive with each other when the input signal transitions from high to low.

A differential switch circuit includes: a first transistor having a first terminal coupled with a first input terminal, a second terminal coupled with a first output terminal, and a control terminal coupled with a switch signal receiving terminal; a second transistor having a first terminal coupled with a second input terminal, a second terminal coupled with a second output terminal, and a control terminal coupled with the switch signal receiving terminal; a central switch element positioned between the control terminals of the first and second transistors; and a switch element control circuit for controlling the central switch element based on a switch signal. When the switch signal turns on the first and second transistors, the switch element control circuit turns off the central switch element, and when the switch signal turns off the first and second transistors, the switch element control circuit turns on the central switch element.

A differential switch circuit includes: a first transistor having a first terminal coupled with a first input terminal, a second terminal coupled with a first output terminal, and a control terminal coupled with a switch signal receiving terminal; a second transistor having a first terminal coupled with a second input terminal, a second terminal coupled with a second output terminal, and a control terminal coupled with the switch signal receiving terminal; a central switch element positioned between the control terminals of the first and second transistors; and a switch element control circuit for controlling the central switch element based on a switch signal. When the switch signal turns on the first and second transistors, the switch element control circuit turns off the central switch element, and when the switch signal turns off the first and second transistors, the switch element control circuit turns on the central switch element.

A technique is provided that reduces dullness of a potential provided to a line such as gate line on an active-matrix substrate to enable driving the line at high speed and, at the same time, reduces the size of the picture frame region. On an active-matrix substrate (20a) are provided gate lines (13G) and source lines. On the active-matrix substrate (20a) are further provided: gate drivers (11) each including a plurality of switching elements, at least one of which is located in a pixel region, for supplying a scan signal to a gate line (13G); and lines (15L1) each for supplying a control signal to the associated gate driver (11). A control signal is supplied by a display control circuit (4) located outside the display region to the gate drivers (11) via the lines (15L1). In response to a control signal supplied, each gate driver (11) drives the gate line (13G) to which it is connected.

A technique is provided that reduces dullness of a potential provided to a line such as gate line on an active-matrix substrate to enable driving the line at high speed and, at the same time, reduces the size of the picture frame region. On an active-matrix substrate (20a) are provided gate lines (13G) and source lines. On the active-matrix substrate (20a) are further provided: gate drivers (11) each including a plurality of switching elements, at least one of which is located in a pixel region, for supplying a scan signal to a gate line (13G); and lines (15L1) each for supplying a control signal to the associated gate driver (11). A control signal is supplied by a display control circuit (4) located outside the display region to the gate drivers (11) via the lines (15L1). In response to a control signal supplied, each gate driver (11) drives the gate line (13G) to which it is connected.

Dual gate FD-SOI transistors are used as MOSFET capacitors to replace passive well capacitors in analog microcircuits. Use of the dual gate FD-SOI devices helps to reduce unstable oscillations and improve circuit performance. A thick buried oxide layer within the substrate of an FD-SOI transistor forms a capacitive dielectric that can sustain high operating voltages in the range of 1.2 V-3.3 V, above the transistor threshold voltage. A secondary gate in the FD-SOI transistor is used to create a channel from the back side so that even when the bias voltage on the first gate is small, the effective capacitance remains higher. The capacitance of the buried oxide layer is further utilized as a decoupling capacitor between supply and ground. In one example, a dual gate PMOS FD-SOI transistor is coupled to an operational amplifier and a high voltage output driver to produce a precision-controlled voltage reference generator. In another example, two dual gate PMOS and one dual gate NMOS FD-SOI transistor are coupled to a charge pump, a phase frequency detector, and a current-controlled oscillator to produce a high-performance phase locked loop circuit in which the decoupling capacitor footprint is smaller, in comparison to the conventional usage of passive well capacitance.