A textile capable of detecting electromagnetic radiation includes interlaced fibers; a photodetector embedded, as a result of a fiber draw process, within a particular one of the fibers; and a first electrical conductor extending within the particular fiber and along a longitudinal axis thereof. The first electrical conductor is in electrical contact with the photodetector, and the photodetector position in the particular fiber corresponds to a lowest energy configuration relative to a pattern of flow along the longitudinal axis of the particular fiber throughout the fiber draw process. A method of manufacturing the textile and a system including the textile are also disclosed.

In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

A display panel, a display device and a signal transmission device are provided. The display panel includes: an array substrate; an opposed substrate arranged opposite to the array substrate; a circuit board, disposed on a side of the array substrate away from the opposed substrate; a driving circuit, disposed on a side of the array substrate close to the opposed substrate; a light emitter, disposed on a side of the circuit board close to the array substrate and electrically connected with the circuit board, in which the light emitter includes a light emitting surface which faces the array substrate; and a light receiver, disposed on a side of the array substrate close to the opposed substrate and electrically connected with the driving circuit, in which the light receiver includes a light receiving surface which faces the light emitter.

A circuit arrangement, a semiconductor module, an electrical system, and a method for optically outputting information using a MOSFET. The circuit arrangement includes a MOSFET with an optical interface and a gate control circuit. The optical interface is configured to guide light, generated by an inverse diode of the MOSFET, into surroundings of the MOSFET. The gate control circuit is configured to receive an input signal representing information to be output using the circuit arrangement, and to generate from the input signal an output signal representing the information to be output. The gate control circuit varies the gate-source voltage of the MOSFET in a reverse mode of the MOSFET based on the output signal to vary a light emission of the inverse diode of the MOSFET in a corresponding manner, so that an output of the information to be output takes place via the optical interface of the MOSFET.

Communications systems and methods for communicating data are provided. In one example, the communications system includes an outer ring having an inner surface and an inner ring having an outer surface. The inner surface and the outer surface are separated by a gap that extends around the inner ring to define a loop. A modulating light arrangement receives data and produces modulated light. A first light diffusing optical fiber and a second light diffusing optical fiber are disposed on a first side of the gap and extend in the loop to define an optical data ring. The first light diffusing optical fiber and the second light diffusing optical fiber cooperate to diffuse the modulated light along the optical data ring. A detector is disposed on the second side of the gap and detects the diffuse modulated light.

The invention provides a free space optical (FSO) communications terminal for a first telecommunications card or a backplane. The FSO terminal comprises a plurality of transmission interfaces. The FSO terminal further comprises a light signal generating unit adapted to generate a plurality of light signals. Each of the plurality of light signals carries the same information as the other one or more of the plurality of light signals and is arranged for transmission through a respective one of the plurality of transmission interfaces. Each of the plurality of light signals is at a different orthogonal mode from the other one or more of the plurality of light signals. The invention further provides a free space optical (FSO) communications terminal for a second telecommunications card or a backplane. The FSO terminal comprises a plurality of receive interfaces. Each of the plurality of receive interfaces adapted to receive a light signal carrying information. The light signal may be at any one of a plurality of orthogonal modes. The FSO terminal further comprises a plurality of optical-to-electrical signal convertors. The invention further provides an optical backplane, a router and an optical node.

A data center includes a plurality of computing units that communicate with each other using wireless communication, such as high frequency RF wireless communication. The data center may organize the computing units into groups (e.g., racks). In one implementation, each group may form a three-dimensional structure, such as a column having a free-space region for accommodating intra-group communication among computing units. The data center can include a number of features to facilitate communication, including dual-use memory for handling computing and buffering tasks, failsafe routing mechanisms, provisions to address permanent interface and hidden terminal scenarios, etc.

RFID (radio frequency identification) systems are provided in which tag and interrogator devices implement a hybrid framework for signaling including an optical transmitter/receiver system and an RF transmitter/receiver system. For instance, an RFID tag device includes: optical receiver circuitry configured to receive an optical signal having an embedded clock signal from an interrogator device, and convert the optical signal into an electrical signal comprising the embedded clock signal; clock extraction circuitry configured to extract the embedded clock signal from the electrical signal, and output the extracted clock signal as a clock signal for controlling clocking functions of the tag device; voltage regulator circuitry configured to generate a regulated supply voltage from the electrical signal, wherein the regulated supply voltage is utilized as a bias voltage for components of the tag device; and data transmitter circuitry configured to wirelessly transmit tag data to the interrogator device.

A communication system that includes a master communication device at a first location in a defined indoor area, a service communication device at a second location in the defined indoor area, and passive optical routing devices at a plurality of locations in the defined indoor area. The master communication device obtains first signal from data source or modem and directs first laser beam carrying the first signal in a downstream path to the service communication device directly or via the plurality of passive optical routing devices. The master communication device receives Laser Beam Network Control instructions from a cloud server, and dynamically changes a laser beam-based communication route from the master communication device to the service communication device by changing a path of laser communication from first set of passive optical routing devices to second set of passive optical routing devices to reach to the service communication device.

Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.