Patent classifications
H04B10/803
On-Chip Optical Interconnection Structure and Network
An on-chip optical interconnection structure and network, where the on-chip optical interconnection structure includes M levels of optical switches, and m.sup.th-level optical switches in the M levels of optical switching devices include 2.sup.m-1 optical switches. Each optical switch in (i-1).sup.th-level optical switches in the M levels of optical switches is coupled to two optical switches in i.sup.th-level optical switches. Two optical switches in the i.sup.th-level optical switches coupled to a same optical switch in the (i-1).sup.th-level optical switches are coupled. The on-chip optical interconnection network is divided into levels, and switches coupled in a grid manner are formed such that hierarchical switching may be performed, and conflicts and delays in communication are reduced.
Free space optical data transmission for secure computing
An apparatus and method for computer network security based on Free-Space Optical Interconnections (FSOI) for board-to-board information transmission. The addition of a controllable, interlocked shutter system creates air-gapped isolation of the boards, allowing for increased obfuscation, and enhanced security.
Transceiver and interface for IC package
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Cable free networking device stacking system
A cable free networking device stacking system includes networking devices that are each configured to operate as part of a networking device stack, and at least one LiFi device included on each of the networking devices. A first LiFi device on a first networking device in the plurality of networking devices transmits networking device stack data communications by receiving first electrical data communications from the first networking device, converting the first electrical data communications to first optical data communications, and wirelessly transmitting the first optical data communications to a second LiFi device included on a second networking device in the plurality of networking devices. The first LiFi device also receives networking device stack data communications by wirelessly receiving second optical data communications from the second LiFi device, converting the second optical data communications to second electrical data communications, and transmitting the second electrical data communications to the first networking device.
Receiving structure/optical interface module assembly
An assembly including an avionics cabinet and a module. The module being insertable into a recess of the avionics cabinet along a longitudinal axis and securely held there in a reversible manner in an operative position. The module having a first face opposite a first wall of the avionics cabinet. The first wall includes a first optical array having first optical emitters and first optical receivers. The first face of the module includes a second optical array having second optical emitters and second optical receivers. When the module is in the operative position, the first and second optical arrays are spaced apart from each other by a predefined distance. Each second optical emitter is arranged opposite a first optical receiver and each second optical receiver is arranged opposite a first optical emitter.
Contactless connector and contactless connector assembly
A contactless connector includes: a circuit board; a light emitter arranged on the circuit board and capable of converting electrical signals into optical signals; a light emitter control chip arranged on the circuit board for controlling the operation of the light emitter; and a light-transmitting member at least partially covering the circuit board, the light emitter, and the light emitter control chip.
Transceiver and interface for IC package
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Transceiver and interface for IC package
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
Semiconductor packages with optical interconnection structures, memory cards including the same, and electronic systems including the same
A semiconductor package includes a first transceiver disposed on a top surface of a substrate; and a second transceiver disposed on a bottom surface of the substrate. The first and second transceivers optically communicate with each other through optical signals that permeate the substrate.
Dynamic beam steering optoelectronic packages
Apparatuses including integrated circuit (IC) optical assemblies and processes for operation of IC optical assemblies are disclosed herein. In some embodiments, the IC optical assemblies include a transmitter component to provide light output having a particular beam direction, and a transmitter driver component. The transmitter component includes a light source optically coupled to a plurality of waveguides, a plurality of gratings, and a plurality of phase tuners. The transmitter driver component causes a light provided by the light source to be centered at a particular wavelength and a particular phase to be induced by each phase tuner of the plurality of phase tuners on a respective waveguide of the plurality of waveguides, in accordance with a feedback signal, to generate the light output having the particular beam direction.