For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.

Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

A fault tolerant optical apparatus resilient to ballistic impact damages, capable of enabling distributed processing and networking and using the spectrophotometric transmission properties of polymer film.

Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

This cyber-retro-reflector technology is a series of Architectures, representing staged deployments, including backward compatibility, of products with enhanced features, for integrating technologies and capabilities, of electronic and photonic systems to: (a) reduce power consumption for circuits and systems that are placed into off and/or disabled states, including external interface portals of electronic and photonic systems, (b) increase and enhance intra-/inter-connectivity, interoperability, and functionality of a system and the aggregate of systems, (c) increase and enhance integrated capabilities leading to higher computational performance for the system and the aggregate of systems, (d) take full advantage of photonic capabilities, and (e) improve hacking detection.

A method and assembly for board to board connection of active devices are described herein. The assembly comprises first and second superposed active devices, a first interfacing member electrically coupled to the first active device, and a flexible printed wiring board having a first end and a second end, the first end electrically coupled to the first interfacing member.

Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

A coupling system includes a first connecting unit and a second connecting unit adapted to be connected to each other. Each of the first connecting unit and a second connecting unit includes an enclosure with a substantial even mating surface and a pair of lens module. Each lens module includes a lens enclosed within a magnet, and the magnets of the coupled lens modules have opposite magnet poles around the corresponding mating surfaces. The pair of lens modules are further equipped with a transmitting chip and a receiving chip in aligned with the corresponding lens, respectively.

Example collective communication methods and apparatus are described In one example method, a computing cluster includes a first node and a second node, where the first node includes a first processor and a second processor, the second node includes a third processor, and second processor is connected to the third processor. In this example, the first processor determines that a processor that is in the first node and that is connected to the third processor in the second node is the second processor, and sends first data to the second processor. Correspondingly, the second processor receives the first data from the first processor, and transmits the first data to the third processor in the second node.

An integrated circuit optical interconnect for connecting a first circuit part arranged to output an optical signal and a second circuit part arranged to receive an optical signal. The integrated circuit optical interconnect comprises a body comprising a glass material. The glass material has embedded therein an optical waveguide arrangement having an input, located at a surface of the body, for coupling to the first circuit part, and an output, located at a surface of the body, for coupling to the second circuit part. The optical waveguide arrangement comprises at least two optical waveguide segments extending in different directions through the glass material and at least one reflecting part arranged between the two optical waveguide segments, for directing an optical signal from one of the optical waveguide segments to the other of the optical waveguide segments. The optical waveguide arrangement is arranged to optically couple the input and the output, whereby an optical signal can pass from the input to the output through the optical waveguide arrangement. There is also provided an integrated circuit module comprising the integrated circuit optical interconnect, and a telecommunications switch comprising the integrated circuit module. There is further provided a method for manufacturing an integrated circuit optical interconnect.