A photoelectric conversion device includes a pixel array including pixels arranged in rows and columns, each of the pixels being configured to output a pixel signal, and including an optical filter and a photoelectric conversion unit, wherein the optical filters of different colors are arranged for each rows and each columns, a holding circuit including first holding units for each of the columns, the first holding units being configured to respectively hold the pixel signals read out from the pixels including the optical filters of different colors in one column of the pixel array in parallel, an output signal line, and a readout circuit configured to successively read out the pixel signals of pixels including the optical filters of the same color from the first holding units for each of the columns to the output signal line.

The present disclosure relates to a solid-state imaging device and an electronic device for suppressing deterioration of pixel characteristics while guaranteeing the operating range of VSLs. A solid-state imaging device according to a first aspect of this disclosure has multiple pixel sharing units each including multiple photoelectric conversion sections each configured to correspond to a pixel, an accumulation section configured to be shared by the plurality of photoelectric conversion sections and to accumulate charges generated thereby, and multiple transistors configured to control reading of the charges accumulated in the accumulation section. The plurality of transistors in each pixel sharing unit are arranged symmetrically. The plurality of transistors include a transistor that functions as a switch to change conversion efficiency. The present disclosure may be applied to back-illuminated CMOS image sensors, for example.

A comparator may include: a comparison block suitable for comparing a ramp signal and a pixel signal and outputting a comparison signal; and a gain acquisition and noise reduction block suitable for amplifying the comparison signal outputted from the comparison block to acquire a gain and reduce an occurrence of noise.

Provided are a solid-state image sensor and an electronic information device capable of effectively reducing the occurrence of pseudo-smear by adopting a simple configuration and operation. A solid-state image sensor 1 includes multiple pixel circuit units P.sub.N and P.sub.OB, each including a photoelectric conversion unit that generates charges via photoelectric conversion and accumulates the generated charges, a floating diffusion unit that retains charges transferred from the photoelectric conversion unit, a transfer unit through which charges accumulated by the photoelectric conversion unit are transferred to the floating diffusion unit, an output unit that outputs a signal corresponding to the amount of charges retained by the floating diffusion unit, and a reset unit that discharges charges retained by the floating diffusion unit to the outside; and an A/D conversion unit 23 that acquires a signal output from the output unit and performs A/D conversion on the acquired signal using a set gain. At least one of the pixel circuit units P.sub.N and P.sub.OB is configured such that charges transferred from the photoelectric conversion unit to the floating diffusion unit and retained by the floating diffusion unit are limited so as not to exceed an upper limit amount which is set to be smaller by the extent of an increase in the gain.

A comparator may include: a comparison block suitable for comparing a ramp signal and a pixel signal and outputting a comparison signal; and a gain acquisition and noise reduction block suitable for amplifying the comparison signal outputted from the comparison block to acquire a gain and reduce an occurrence of noise.

An electronic circuit includes a unit pixel, a first clamp circuit, and a second clamp circuit. The unit pixel outputs a voltage having an output voltage level at a first output voltage level in a first time interval and at a second output voltage level in a second time interval different from the first time interval. The first clamp circuit is configured to clamp the output voltage level from the unit pixel to a first voltage level responsive to the first output voltage level being not greater than the first voltage level in the first time interval. The second clamp circuit is configured to clamp the output voltage level from the unit pixel to a second voltage level responsive to the second output voltage level being not greater than the second voltage level in the second time interval.

1. Method and device for correcting readout smear artifacts.

2.1. Known methods for correcting smear artifacts that occur when reading out CCD sensors require considerable computing time; their implementation is cumbersome. The new method should enable more simple and efficient implementations.

2.2 In order to enable an efficient calculation of a corrected image, the readout image values and the correction values to be used are first transformed with a suitable transformation into a frequency range in which the transformed image values are then corrected by means of the transformed correction values through use of a folding operation. The folding can then be calculated in parallel. Furthermore, a method for approximately calculating corrections for an aperiodic readout smear is provided. Different efficient implementations in hardware are introduced.

2.3 Based on their efficiency, the method and the device are suitable in particular for scientific sensors that require high fill factors of the pixels but also for image sensors that are used in smartphones.

An imaging device includes: a semiconductor substrate; pixels arranged two-dimensionally along row and column directions on the substrate; and one or more interconnection layers located on the semiconductor substrate, including a first signal line extending along the column direction and a second signal line to which a multi-level signal is applied. A first pixel includes: a photoelectric converter; a charge storage region; a first interconnection electrically connected to the charge storage region; and a first transistor that includes a first diffusion layer electrically connected to the first signal line and a second diffusion layer electrically connected to the second signal line and that outputs a signal to the first signal line. The first and second signal lines and the first interconnection are arranged in a first interconnection layer. The second signal line is located between the first interconnection and the first signal line, viewed perpendicularly to the substrate.

A solid-state imaging device includes: a pixel region in which a plurality of pixels composed of a photoelectric conversion section and a pixel transistor is arranged; an on-chip color filter; an on-chip microlens; and a multilayer interconnection layer in which a plurality of layers of interconnections is formed through an interlayer insulating film. The solid-state imaging device further includes a light-shielding film formed through an insulating layer in a pixel boundary of a light receiving surface in which the photoelectric conversion section is arranged.

The present disclosure relates to a solid-state imaging device and an electronic device for suppressing deterioration of pixel characteristics while guaranteeing the operating range of VSLs. A solid-state imaging device according to a first aspect of this disclosure has multiple pixel sharing units each including multiple photoelectric conversion sections each configured to correspond to a pixel, an accumulation section configured to be shared by the plurality of photoelectric conversion sections and to accumulate charges generated thereby, and multiple transistors configured to control reading of the charges accumulated in the accumulation section. The plurality of transistors in each pixel sharing unit are arranged symmetrically. The plurality of transistors include a transistor that functions as a switch to change conversion efficiency. The present disclosure may be applied to back-illuminated CMOS image sensors, for example.