Patent classifications
H05B3/26
HEAT CONDUCTION MEMBER FOR PREVENTING FUSER HEATER FROM OVERHEATING
An example fuser includes a flexible fixing belt, a back-up to form a fixing nip with the fixing belt, a heater substrate having a first surface on which a heating element pattern is located and a second surface opposite to the first surface, the heater substrate to heat the fixing belt at the fixing nip, and a heat conduction member having a plurality of heat conduction segments contacting the first surface of the heater substrate.
EXHAUST GAS HEATING ELEMENT
An exhaust gas heating element comprises a wafer that is substantially cylindrical with an axis and is made of metallic foam. A flexible, electrical insulating sheet covers an edge of the wafer with an overlap on each face of the wafer. A rigid assembly ring, a housing, and two electrodes are also provided. The rigid assembly ring is made from a cylinder trunk, at least a first edge of which is serrated in such a way as to be able to immobilize the wafer and the flexible, electrical insulating sheet in the rigid assembly ring by folding teeth, substantially at 90°.
ELECTRONIC VAPING DEVICE
An electronic vaping device includes a housing, a planar heater, a heater support, a tank, and a wick. The housing extends in a longitudinal direction and has a tip end and a mouth-end. The tip end is closed and the mouth-end has an opening therein. The heater support supports the planar heater. The tank contains a pre-vapor formulation and is configured to slide into and out of the opening of the mouth-end of the housing. The wick extends from the tank and is configured to be in contact with the planar heater when the tank is inserted in the housing.
ELECTRONIC VAPING DEVICE
An electronic vaping device includes a housing, a planar heater, a heater support, a tank, and a wick. The housing extends in a longitudinal direction and has a tip end and a mouth-end. The tip end is closed and the mouth-end has an opening therein. The heater support supports the planar heater. The tank contains a pre-vapor formulation and is configured to slide into and out of the opening of the mouth-end of the housing. The wick extends from the tank and is configured to be in contact with the planar heater when the tank is inserted in the housing.
Heated media line
A heat conductor and a heated media line having an inner tubular fluid line and at least one heat conductor arranged on the periphery thereof. The heat conductor is formed by a braid made of twisted individual wires and, in particular, an outer protective sheath surrounding the heat conductor and the fluid line. The braid is formed by at least six individual wires surrounding a support element, of which at least one individual wire is made of a copper-nickel (CuNi) alloy, and the remaining individual wires are produced from copper (Cu) or from a nickel-chromium (NiCr) alloy. All of the individual wires have the same diameter.
Heated media line
A heat conductor and a heated media line having an inner tubular fluid line and at least one heat conductor arranged on the periphery thereof. The heat conductor is formed by a braid made of twisted individual wires and, in particular, an outer protective sheath surrounding the heat conductor and the fluid line. The braid is formed by at least six individual wires surrounding a support element, of which at least one individual wire is made of a copper-nickel (CuNi) alloy, and the remaining individual wires are produced from copper (Cu) or from a nickel-chromium (NiCr) alloy. All of the individual wires have the same diameter.
PPTC HEATER AND MATERIAL HAVING STABLE POWER AND SELF-LIMITING BEHAVIOR
A polymer positive temperature coefficient (PPTC) material may include a polymer matrix, the polymer matrix defining a PPTC body; and a graphene filler component, disposed in the polymer matrix, wherein the graphene filler component comprises a plurality of graphene particles aligned along a predetermined plane of the PPTC body.
TRANSMISSION ELECTRON MICROSCOPE IN-SITU CHIP AND PREPARATION METHOD THEREFOR
The present disclosure discloses a transmission electron microscope in-situ chip and a preparation method thereof. The transmission electron microscope in-situ chip includes a transmission electron microscope high-resolution in-situ gas phase heating chip, a transmission electron microscope high-resolution in-situ liquid phase heating chip and a transmission electron microscope in-situ electrothermal coupling chip. The transmission electron microscope high-resolution in-situ gas phase heating chip and the transmission electron microscope high-resolution in-situ liquid phase heating chip are respectively suitable for gas samples and liquid samples, and the transmission electron microscope in-situ electrothermal coupling chip realizes the multi-functional embodiment of electrothermal coupling. The three transmission electron microscope in-situ chips have the advantages of high resolution and low sample drift rate.
FLUID PERMEABLE HEATER ASSEMBLY FOR AN AEROSOL-GENERATING SYSTEM AND METHOD FOR ASSEMBLING A FLUID PERMEABLE HEATER FOR AN AEROSOL-GENERATING SYSTEM
A cartridge for an aerosol-generating system is provided, including a liquid storage portion including a housing containing a liquid aerosol-forming substrate, the housing having an open end; and a heater assembly including: an electrical heating element configured to heat the substrate to form an aerosol, the heating element including a planar filament arrangement having one or more electrically conductive filaments, an electrically insulating substrate having a planar attachment face, the filament arrangement disposed on the planar attachment face, and clamping elements mechanically fixing the filament arrangement to the electrically insulating substrate and applying a pulling force onto the filament arrangement, at least a portion of the heater assembly being fluid-permeable, and the heater assembly being arranged over the open end of the housing.
Fluidic chip
A fluidic chip comprising: a sealing layer having an upper surface and a lower surface; and a formed part comprising a generally planar body having a lower surface sealed with the upper surface of the sealing layer, the generally planar body having a number of through holes and a number of wells in fluid communication with the number of through holes, wherein together with the upper surface of the sealing layer, the number of through holes and the number of wells respectively define a number of fluid inlets and a number of fluid chambers in fluid connection with each other in the fluidic chip.