H05K1/0278

AUTOCLAVABLE ELECTRONICS UNIT FOR AN ENDOSCOPE, METHOD FOR PRODUCING AN AUTOCLAVABLE ELECTRONICS UNIT AND ENDOSCOPE

An autoclavable electronics unit for an endoscope, the autoclavable electronics unit including: a multi-layer printed circuit board having a rigid region and a flexible region, the rigid region being reinforced by stiffener material to have a greater rigidity than the flexible region and the flexible region is configured to be bendable. Where the multi-layer printed circuit board is formed from structured layers made of conductive and non-conductive materials adhered together, in which the conductive structures form conductor tracks and contact surfaces; the rigid region is provided with one or more electronic components; and the rigid region is covered by an epoxy resin.

ASSEMBLY COMPRISING A CIRCUIT CARRIER AND A HEAT SINK
20220210908 · 2022-06-30 ·

An arrangement is provided comprising a circuit carrier and a heat sink. The circuit carrier has at least one arc-shaped curved region, and the heat sink also has at least one arc-shaped curved region. The arc-shaped curved region of the circuit carrier is either inwardly or outwardly curved, and the arc-shaped curved region of the heat sink is the opposite either outwardly or inwardly curved. The contour of the arc-shaped curved region of the circuit carrier corresponds to the contour of the arc-shaped curved region of the heat sink. The curved region of the heat sink and the curved region of the circuit carrier are connected to one another.

Aerosol generator and atomizing module

An aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber and an aerosol chamber respectively arranged at two opposite sides of the atomizing module. The atomizing module includes an annular vibration plate, a microporous member, and a circuit board. The vibration plate has a first hole, and the microporous member is disposed on the vibration plate and covers the first hole. The circuit board is electrically coupled to an electrical contact of the vibration plate. The circuit board is arranged at one side of at least part of the vibration plate, and the circuit board and the at least part of the vibration plate have a gap there-between. A projected region defined by orthogonally projecting the circuit board onto a plane overlapping with the electrical contact partially covers the least part of the vibration plate.

Transmission line cable including an unbendable superimposed layer part and a bendable non-superimposed layer part

The invention provides a transmission cable with a main baseline layer and a superimposed line layer. The main baseline layer includes a superimposed part, and a non-superimposed part. The superimposed line layer and the superimposed part form an unbendable part; the non-superimposed part forms a bendable par. The main baseline layer includes a first grounding layer, a first base layer stacked, a signal line layer, and a second base layer. The superimposed line layer includes a third base layer and a second grounding layer. The bendable part is small in thickness, so that the transmission cable provided by the invention has good bending performance, thereby improving the practicability of the transmission cable and prolonging the service life of the transmission cable.

SENSOR UNIT FOR VEHICLES

A sensor unit for vehicles for detecting at least the moisture and/or the temperature on the inside of a vehicle window by a sensor is disclosed. The sensor unit is mounted adjacent to the inside of the vehicle window, the sensor unit comprises a housing within which it is partially enclosed, the housing has at least one opening in the direction of the vehicle window through which the sensor unit is pressed against the vehicle window. The sensor unit has a printed circuit board (PCB) that is pressed against the inside of the vehicle window when the sensor unit is in the mounted state, and is arranged between the sensor and the vehicle window. The PCB is a rigid-flexible PCB comprising a bend at least in a partial region, the bend of the rigid-flexible PCB being set up in such a way as to generate an elastic restoring force, which presses the rigid-flexible PCB against the vehicle window. The rigid-flexible PCB has at least one recess for receiving a fixing means and these together are designed to hold the rigid-flexible PCB in a specific shape.

AEROSOL PROVISION DEVICE

Aerosol provision devices having printed circuit boards are described. One such aerosol provision device defines a longitudinal axis and comprises an electrical connector, a heater assembly configured to heat aerosol generating material received within the device and a printed circuit board (PCB). The PCB comprises a first portion arranged substantially parallel to the longitudinal axis and a second portion arranged substantially perpendicular to the longitudinal axis. The heater assembly is electrically coupled to the first portion. The second portion is electrically coupled to the first portion and the electrical connector is electrically coupled to the second portion. Another such aerosol provision device comprises a first coil for heating a heater component and a PCB arranged adjacent to the first coil. The PCB comprises: a first through hole connected to a first end of the first coil; and a second through hole connected to a second end of the first coil.

LIGHT SOURCE SUPPORT FOR AUTOMOTIVE VEHICLE

The present invention relates to a light source support of an automotive vehicle. The light source support comprises: a first non-flexible part adapted to be mounted with a plurality of first electronic components; and a second non-flexible part adapted to be mounted with a plurality of second electronic components. The light source support further comprises a flexible arm adapted to join the first non-flexible part and the second non-flexible part to form the light source support, which is twistable and rotatable. The first non-flexible part and the second non-flexible part are joined in a non-axial manner by the flexible arm such that a longitudinal axis of the first non-flexible part is not parallel to a longitudinal axis of the second non-flexible part when the first non-flexible part is joined with the second non-flexible part.

Flexible substrate, method for producing the same and flexible display device

A flexible substrate is provided. The flexible substrate includes: a flexible layer, wherein the flexible layer has a plurality of notches which have a first maximum width along a stretching direction in a stretched state of the flexible layer and have a second maximum width along the stretch direction in an unstretched state of the flexible layer, and wherein the first maximum width is greater than the second maximum width. A flexible display apparatus including the above flexible substrate and a method for producing the flexible substrate are also provided.

Semi-Flex Component Carrier With Dielectric Material Having High Elongation and Low Young Modulus
20220159828 · 2022-05-19 ·

A semi-flex component carrier includes a stack having at least one electrically insulating layer structure, at least one electrically conductive layer structure and a stress propagation inhibiting barrier. The stack defines at least one rigid portion and at least one semi-flexible portion. The stress propagation inhibiting barrier includes a plurality of stacked vias filled at least partially with electrically conductive material in an interface region between the at least one rigid portion and the at least one semi-flexible portion and configured to inhibit stress propagation between the at least one rigid portion and the at least one semi-flexible portion during bending.

Flexible Package Architecture Concept in Fanout

Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.