A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

A field programmable solder BeTA (FPSBGA) module may be utilized to assemble PCB/Substrate in any stack-up configuration. The local field programmable soldering BGA includes control system provides the necessary feedback for effective control of thermal profiles. The FPSBGA enables a control component (110) to cause the execution of the temperature application component (120) to cause a non-uniform application of specified temperature parameters to the substrate.

A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.

To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290 C. to 420 C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.

A circuit can include a pre-patterned substrate having a supporting material, multiple segments thereon, and interdigitated line structures within each segment. Some of the line structures can be bundled together, and an electrical component can be formed by ink jetting onto the bundled line structures.

A method for manufacturing a transparent conductive film, including: 1) providing a conductive scraper including a slurry feeding mouth and a slurry discharging gap; 2) placing a transparent film including a prefabricated groove on a conductive moving table, moving the conductive moving table horizontally in relation to the conductive scraper, controlling the moving speed of the conductive moving table at between 0.1 and 1 m/min, and allowing the conductive slurry to flow out of the conductive scrapper via the slurry discharging gap; 3) applying a voltage between the conductive moving table and the conductive scraper, and driving the conductive slurry flowing out of the conductive scraper to fill the groove of the transparent film by an electrodynamic force produced by the voltage; and 4) curing the conductive slurry filled in the groove of the transparent film.

Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.