There is provided a semiconductor apparatus including a first high-speed communication controller and a second high-speed communication controller that perform high-speed communication; a first high-speed communication terminal group that includes a first high-speed communication terminal for inputting a first signal; a second high-speed communication terminal group that includes a second high-speed communication terminal for inputting a second signal; and a terminal mounting surface, in which the terminal mounting surface includes a first side and a second side, a shortest distance from the first high-speed communication terminal group to the first side is shorter than a shortest distance from the second high-speed communication terminal group to the first side, and a shortest distance from the second high-speed communication terminal group to the second side is shorter than a shortest distance from the first high-speed communication terminal group to the second side.

There is provided a semiconductor apparatus including: a memory operation terminal for inputting a first signal; a high-speed communication terminal for inputting a second signal to a high-speed communication controller; an inspection terminal for performing debugging; and a terminal mounting surface at which a plurality of coupling terminals including the memory operation terminal, the high-speed communication terminal, and the inspection terminal are provided, in which the terminal mounting surface includes a first side, a second side, a third side, and a fourth side, the plurality of coupling terminals include a first terminal row located adjacent to the third side and arranged from the first side toward the second side; the first terminal row includes a first inspection terminal among the plurality of inspection terminals, and the first inspection terminal is located closest to the first side in the first terminal row.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material 1, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film.

A battery system that is formed from a plurality of battery cells arranged on a flexible printed circuit card, where the flexible printed circuit card is folded along an axis forming an upper and lower portion of the flexible circuit card. A visco-elastic shock-absorbing member installed between the upper and lower portion of the flexible circuit card. Each battery cell may also have a visco-elastic shock-absorbing member that is attached individually to each battery cell of the plurality of battery cells.

A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.

A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.

A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

An object of the present invention is to provide a method for easily producing an electroconductive laminate having a three-dimensional shape and having a metal layer disposed thereon (for example, an electroconductive laminate having a three-dimensional shape including a curved surface and a metal layer disposed on the curved surface). Another object of the present invention is to provide a three-dimensional structure with a plated-layer precursor layer, a three-dimensional structure with a patterned plated layer, an electroconductive laminate, a touch sensor, a heat generating member, and a three-dimensional structure. The method for producing an electroconductive laminate of the present invention has a step of obtaining a three-dimensional structure with a plated-layer precursor layer including a three-dimensional structure and a plated-layer precursor layer disposed on the three-dimensional structure and having a functional group capable of interacting with a plating catalyst or a precursor thereof and a polymerizable group; a step of applying energy to the plated-layer precursor layer to form a patterned plated layer; and a step of subjecting the patterned plated layer to a plating treatment to form a patterned metal layer on the plated layer.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.