The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.

An apparatus for toggling circuits includes a plurality of parallel channels each having a first end and a second end, a plurality of ports transverse to the plurality of parallel channels, wherein each port has a plurality of valves corresponding to the plurality of parallel channels, wherein each valve selectively opens and closes in response to an input and wherein opening a valve fills a portion of a port with a conducting fluid. The apparatus also includes a controller communicatively coupled to the input of each valve and configured to complete an electric circuit between the first end of the parallel channel and the port corresponding to the valve when the controller opens the valve. A method executed by a computer and a corresponding computer program product are also disclosed herein.

A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.

A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.

A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

The invention provides a printed circuit board (10) including a first electrically conductive track (210), wherein the printed circuit board (10) comprises a set (15) of two printed circuit board areas (100) both comprising a part of the first electrically conductive track (210), wherein printed circuit board (10) further comprises a perforation line (300) between the two printed circuit board areas (100) for customizing the printed circuit board (10) into two physically separated printed circuit board area comprising parts (1100), wherein the perforation line (300) is configured as a non-straight line, wherein the perforation line (300) comprises relative to one of the printed circuit board areas (100), and in a plane of the printed circuit board (10), a first projecting part (311) and a first recessed part (312), wherein the first recessed part (312) is recessed relative to the first projecting part (311), wherein the first electrically conductive track (210) is intercepted by the perforation line (300) at the first recessed part (312).

An electronic assembly, has at least one circuit board with conductor tracks, at least one current-limiting arrangement in the form of a thermal predetermined breaking point in at least one of the conductor tracks, and a fire-containment device in the region of the current-limiting arrangement.

Provided are a circuit board and production method therefor, a circuit device and production method therefor, and a printing material container assembly. The circuit board is mounted on a printing material container. The circuit board includes an original circuit board and an auxiliary part. The original circuit board includes multiple terminals configured to be in contact with the printing material container or a printing device. The auxiliary part is disposed on the original circuit board and is configured to perform at least one of the following: providing a conductive path or breaking off a conductive path between the terminals.