An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

A metal stem includes a cylindrical portion in which an FPC inserting portion is formed, and a base standing upright from one plane of the cylindrical portion. A tubular lens cap with one open end is fixed to a peripheral portion of the one plane of the cylindrical portion, and has a lens mounted on a bottomed portion. A substrate mounted on one plane of the base includes a signal wiring layer and a ground wiring layer. An optical semiconductor element is mounted on the substrate and has a signal terminal connected to the signal wiring layer of the substrate, and a ground terminal connected to the ground wiring layer of the substrate. An FPC substrate is disposed so as to pass through the FPC inserting portion and to face the one plane of the base. The FPC substrate includes a signal wiring layer connected to the signal wiring layer of the substrate with a metal wire.

A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the open region, the plurality of bent portions are bent to rotate in the same direction as each other, each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and the metal layer includes a first metal layer and a second metal layer that is disposed on the first metal layer and has an electrical conductivity different from that of the first metal layer.

A method for producing a metal-ceramic substrate with electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.

The present disclosure provides a manufacturing method of a flat panel liquid crystal antenna, including the following steps: providing a first substrate, wherein the two sides of the first substrate are provided with a first metal film layer and a third metal film layer respectively; simultaneously patterning the metal film layer on the two sides to obtain a patterned first metal film layer and a patterned third metal film layer; providing a second substrate, wherein one side of the second substrate is provided with a second metal film layer; patterning the second metal film layer to obtain a patterned second metal film layer; and oppositely bonding the first substrate and the second substrate to form a liquid crystal cell, and preparing a liquid crystal layer. The present disclosure also provides a flat panel liquid crystal antenna by using the above method.

An optoelectronic apparatus (200) and an optoelectronic integration method are disclosed, so that bandwidth for signal transmission can be improved, and signal transmission performance is improved. The optoelectronic apparatus (200) includes: a printed circuit board PCB (201), where a first substrate (203) and a second substrate (205) are separately disposed on the PCB (201), an application specific integrated circuit ASIC (202) is disposed on the first substrate (203), and an optoelectronic component (204) is disposed on the second substrate (205); and a flexible printed circuit FPC (206), where a first end of the FPC (206) is disposed on an upper surface of the first substrate (203) and is electrically connected to the ASIC (202), and a second end of the FPC (206) is disposed on the second substrate (205) and is electrically connected to the optoelectronic component (204).

A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate but do not protrude from this side surface, and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes at least partially overlap each other in a thickness direction of the ceramic multilayer substrate, with a distance in the thickness direction between the overlapping ground electrodes being 5 μm or greater.

A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.

A laminated glass assembly, an electrical assembly for a laminated glass assembly and a method of forming a laminated glass assembly. The laminated glass assembly includes at least an outer glass plate having a first major surface and a second major surface, an inner ultra-thin glass plate having a first major surface and a second major surface and an intermediate film layer situated between the outer glass plate and the inner ultra-thin glass plate. The electrical assembly is positioned between the outer glass plate and the inner ultra-thin glass plate along with a conductive medium to provide a signal path between the laminated glass assembly and vehicular electrical circuitry.

The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (310) mounted on the top surface of the PCB substrate (400) to correspond to locations between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.