A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

An electronic-grade glass fiber composition includes the following components with corresponding amounts by weight percentages: 54.2-60% SiO.sub.2, 11-17.5% Al.sub.2O.sub.3, 0.7-4.5% B.sub.2O.sub.3, 18-23.8% CaO, 1-5.5% MgO, less than or equal to 24.8% CaO+MgO, less than 1% Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% TiO.sub.2, 0.05-0.7% Fe.sub.2O.sub.3, and 0.01-1.2% F.sub.2. The weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.20, and the total weight percentage of the above components is greater than or equal to 98.5%.

A connector assembly is provided. The connector assembly includes a socket to receive a plug and having an electrical contact. The connector assembly further includes a flexible fabric embedded with a pattern of electrically conductive elements and spanning the socket to conceal the electrical contact. The flexible fabric can deform toward the electrical contact of the socket to cause at least a portion of the pattern to contact the electrical contact.

Warpage reduction through laminate glass cloth design modification is described herein. In one example, a substrate for a microelectronic assembly, includes one or more glass-cloth containing layers. At least one of the glass-cloth containing layers includes a glass cloth having a weave including: a first plurality of parallel glass fibers, a second plurality of parallel glass fibers, and a third plurality of parallel glass fibers interwoven with one another in a plane. The second plurality of parallel glass fibers crosses the first plurality of glass fibers at a first angle, and the third plurality of parallel glass fibers crosses the first plurality of glass fibers at a second angle and crosses the second plurality of glass fibers at a third angle. In one example, the glass cloth weave includes a hexagonal pattern.

A conductive bump electrode structure includes a substrate, an elastic circuit layer, at least two conductive bumps, and an insulating layer. The elastic circuit layer is mounted on the substrate, and includes at least one elastic circuit. The at least two conductive bumps are mounted on the elastic circuit layer, and are electrically connected to each other through the at least one elastic circuit. The insulating layer is mounted on the elastic circuit layer, and includes at least two holes. Since there is a gap between the conductive bumps, the conductive bump electrode structure is easy to be bent and fit body curves of various parts of a user. The elastic circuit can stretch or compress along with the user's movement due to its elasticity, thereby increasing suitability of the conductive bump electrode structure to the human body.

Techniques and systems are disclosed for implementing textile-based screen-printed amperometric or potentiometric sensors. The chemical sensor can include carbon based electrodes to detect at least one of NADH, hydrogen peroxide, potassium ferrocyanide, TNT or DNT, in liquid or vapor phase. In one application, underwater presence of chemicals such as heavy metals and explosives is detected using the textile-based sensors.

Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO.sub.2≤60, 25≤B.sub.2O.sub.3≤45, 0<Al.sub.2O.sub.3≤18, 0<R.sub.2O≤5, and 0≤RO≤12, and satisfies at least one of: i) SiO.sub.2+B.sub.2O.sub.3≥80 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9; and ii) SiO.sub.2+B.sub.2O.sub.3≥78, SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9, and 0<RO<10. Another glass composition provided includes SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, R.sub.2O, and 3<RO<8 at the same contents as the above, and satisfies SiO.sub.2+B.sub.2O.sub.3≥75 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3<97, where R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O and RO=MgO+CaO+SrO.