A field device connection unit has a main body, on which a plurality of connection elements for connection of connecting lines to field devices and a plurality of slots each intended for receiving a respective plug-in unit are arranged. The plug-in unit has a first group of field-side plug contact devices which are connected by the connection elements for connection of connecting lines to field devices, and a second group of system-side plug contact devices which are connected to a higher-level arrangement. For testing of the field device connection unit when the field wiring is disconnected, the plug-in units have a resilient latching cam, which latches switchably in a recess in the main body, the contacts of the second group of system-side plug contact devices being closed and the contacts of the first group of field-side plug contact devices being opened.

According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

A driving chip and a display panel are provided. The display panel includes the driving chip, and a plurality of first bonding pads and a plurality of second bonding pads disposed at two opposite sides out of the driving chip. The driving chip includes a group of first input leads and a group of second input leads. There is an interval between the group of first input leads and the group of second input leads. The group of first input leads is disposed near the first bonding pads, and the group of second input leads is disposed near the second bonding pads.

Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural electrodes, respectively, wherein the substrate includes a notch formed between electrode groups each of which includes a predetermined number of the electrodes.

A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.

A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal receive the first signal from the buffer at the same time. The first connection terminal be is closer to the buffer as compared with the second connection terminal. The third connection terminal is closer to the buffer as compared with the fourth connection terminal.

A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

A support for light source(s) for a lighting and/or light signaling module for a motor vehicle, comprising a substrate of thermally conductive material, preferentially of metallic material, at least one light source of the light-emitting or laser diode type with a face for mounting on the substrate, in thermal contact therewith and an electrical power supply circuit for the light source or sources. The power supply circuit is linked electrically with the light source or sources by means of metal wires soldered on the surface by the technology commonly referred to by the expression “wire bonding”. The measures of the invention make it possible to define at least one reception plane for the light sources oriented in such a way as to avoid having components in the vicinity of the light sources casting shadows thereon.