An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

An electrical connector assembly including an electrical connector and a circuit board is provided. The electrical connector has a metallic plate and a plurality of terminals. The metallic plate separates the terminals into two different areas. The metallic plate has a first lateral surface. The circuit board is assembled to the electrical connector. The circuit board has a plurality of pads, a second lateral surface, and top and bottom surfaces opposite to each other. The pads are disposed on the top and bottom surfaces respectively. The second lateral surface is boarded between the top and bottom surfaces. The circuit board further includes at least one grounding circuit exposed from the second lateral surface and facing toward the first lateral surface. The metallic plate is electrically conducted to the grounding circuit by the first lateral surface when the circuit board is assembled to the electrical connector.

A multilayer circuit board includes an upper surface and an opposing lower surface. An electrically insulating layer is disposed between the upper and lower surfaces. A plurality of electrically conductive upper and lower rear pads are disposed proximate a rear edge on the respective upper and lower surfaces for termination of a plurality of wires. The upper and lower rear pads include respective upper and lower rear ground pads substantially aligned with each other and configured for termination of ground wires. A plurality of electrically conductive front pads are disposed proximate a front edge for insertion into a connector and electrically connected to the upper and lower rear pads. An electrically conductive via extends from the upper rear ground pad to the lower rear ground pad and makes electrical and physical contact with each of the upper and lower rear ground pads.

Disclosed is an industrial control device including a point-to-point backplane/point module architecture providing RIUP (Removal and Insertion Under Power) functionality where data communications between modules is maintained after the removal of a point module from the backplane. According to an exemplary embodiment, a backplane includes a plurality of passive mechanical bypass switches controlled by the insertion and removal of respective point modules, whereby data communicated bypass a removed point module interface and point-to-point data communications are provided to an inserted point module after an initial routine is executed by a microcontroller associated with the inserted point module.

A stator of an electric motor includes a stator core having a plurality of teeth. A printed circuit board (PCB) is fixed with respect to the stator and includes a plurality of soldering structures defined within a surface of the printed circuit board. A winding set is disposed on the teeth. The winding set includes at least one wire that is wound around the teeth to at least partially define stator poles. Each wire of the winding set includes opposing ends that are attached to the printed circuit board at a dedicated soldering structure of the plurality of soldering structures.

An edge conductor includes a first portion electrically connected to a first conductor on a first surface of a substrate, a second portion electrically connected to a second conductor on a second surface of the substrate, a third portion extending between the first portion and the second portion along an edge of the substrate, and a coating covering at least a portion of the third portion of the edge conductor, where the second surface of the substrate is opposite the first surface of the substrate, and the edge of the substrate extends between the first surface of the substrate and the second surface of the substrate.

An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

Connector paddle cards are provided with an improved wiring connection geometry that reduces impedance mismatch. One illustrative embodiment is a printed circuit board having, on at least one surface: edge connector traces arranged along a first edge for contacting electrical conductors in a socket connector; an outer set of electrodes arranged parallel to a second edge for attaching exposed ends of sheathed wires in a cable (“outer wires”); and an inner set of electrodes arranged parallel to the second edge for attaching exposed ends of sheathed wires in a cable (“inner wires”), with the electrodes in the inner set being staggered relative to the electrodes in the outer set.

According to examples, a memory module with module rows of conductive contacts can enable multiple memory channels to be connected to the same memory module. In one example, a memory module includes a printed circuit board (PCB) having a first face, a second face, and an edge to be received by a connector. The memory module includes a plurality of memory chips on at least one of the first and second faces of the PCB. The memory module includes two or more rows of conductive contacts on each of the first and second faces of the PCB, the two rows including a first row of conductive contacts proximate to the edge of the PCB to be received by the connector, and a second row of conductive contacts between the first row and a second edge of the PCB opposite to the first edge.

A compute system is provided that includes cables that are terminated to a grid array connector that is mounted on a substrate that has an integrated circuit packaged mounted thereon. The cables include conductors that are electrically connected to the integrated circuit via terminals supposed by the substrate.