A method of manufacturing a component carrier is described. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and cutting out the component carrier from the stack along a closed circumferential laser cutting trajectory by a pulsed laser beam having a pulse length of less than 1 ns.

A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.

A method of making a LED light bulb with the Graphene filament contains steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate; C. cutting the printed circuit board (PCB) on which a graphene-based heat dissipation film is coated to form plural Graphene filaments; D. fixing the plural Graphene filaments into a light bulb. The flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. The graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. In addition, the Graphene filaments are fixed in a bended or arched position.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.

The disclosure provides a display device including a first substrate, a display region disposed above the first substrate; a second substrate; a sealant disposed between the first substrate and the second substrate and outside the display region; and, a plurality of spacers disposed within the sealant. In particular, the first substrate and the second substrate are bonded together via the sealant. Further, the first substrate has a side wall including a first cutting crack surface and a first median crack surface, wherein a roughness of the first cutting crack surface is different from that of the first median crack surface.

A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.