A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

Glass layers having partially embedded conductive layers for power delivery in semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer having a thickness between a first surface opposite a second surface. The core layer includes a trench provided in the first surface. The trench partially extending between the first surface and the second surface. An electrically conductive material is positioned in the trench. A trace is provided on the conductive material. The trace is offset in a direction away from the first surface and away from the second surface of the core layer.

It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.

The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.

A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.

The inventive concepts relate to a method of manufacturing a hybrid metal pattern and a hybrid metal pattern manufactured thereby. In the method, the hybrid metal pattern may be manufactured on a substrate (e.g., a flexible substrate), formed of various materials, at room temperature without damaging the substrate, by a wire explosion method in liquid and light-sintering. In more detail, when performing the wire explosion method in liquid according to conditions of the inventive concepts, metal particles having uniform nano-sizes and uniform micro-sizes can be formed by a simple process, and additional dispersing and collecting processes can be omitted. In addition, conductive hybrid ink is formed by adding a metal precursor and then is light-sintered. In this case, the hybrid metal pattern can be manufactured by a very simple process.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

A method of manufacturing a device with a planar electrode structure, the method comprising: (a) forming a microfluidic channel on a substrate; (b) applying a primer layer to at least part of the microfluidic channel, (c) applying a conductive liquid to the microfluidic channel, the conductive liquid comprising electrically conductive particles dispersed in a carrier medium, the carrier medium including a solvent; (d) allowing the conductive liquid to flow throughout the microfluidic channel by capillary action to form the planar electrode structure; and (e) evaporating the solvent from the carrier medium, is described. Devices obtainable using the method and their applications are also described.