There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

A method of manufacturing an assembly with a housing part and at least two conductors of shape sheet metal parts may include providing at least one first conductor formed from at least one sheet metal part and at least one second conductor formed from at least one sheet metal part. The method may then include arranging the first and second conductors in an injection mould in such a way that the first conductor may come into mechanical contact with the second conductor in a common contact zone to produce an electrical connection. The method may then include at least partially overmoulding the first and second conductors with a plastic to form a joint housing part. The method may further include bonding the first and second conductors in a region of the common contact zone after at least partially overmoulding the first and second conductors.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.

Disclosed in the present application are a base with an electronic element and a voice coil motor. The base with an electronic element comprises an electronic element, a metal circuit, a first plastic member, and a second plastic member. The metal circuit is connected to the electronic element and comprises a plurality of branches, a first end of the plurality of branches being connected on a one-to-one basis with pins of the electronic element; the first plastic member is positioned at the connecting position of the metal circuit and the electronic element, and is configured to integrally connect all of the branches of the metal circuit, and limit each branch of the metal circuit; and the second plastic member covers the metal circuit, a second end of the branches of the metal circuit furthest from the electronic element extending out from the second plastic member.

A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.sup.2.

A light fixture has a translucent tubular bulb. At least one end cap is located at one end of the translucent tubular bulb. A light engine is disposed in the translucent tubular bulb. The light engine has a leadframe on which a plurality of semiconductor light elements is arranged. The fixture may include an electronic driver. The electronic driver includes a plurality of electronic components. At least one of the plurality of electronic components is arranged inside the transparent tubular bulb.