An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

A mechanically-stable and thermally-conductive interface device between a semiconductor die and a package for the die, and related method of fabrication, comprising: a semiconductor die; a package for the die; a surface area-enhancing pattern on the package and/or the die; and die attach materials between the die and the package, the die attach materials attaching the die to the package through an interface provided by the die attach materials; wherein: an effective bonding area between the die attach materials and the package and/or the die is greater with the pattern than without the pattern; and the increase of the effective bonding area simultaneously increases the surface area for thermal transport between the package and/or the die, and the die attach materials; and increases the surface area for stably attaching the at least one of the package and the die to the die attach materials.

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence.

A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

The present invention relates to electric components of interventional devices. In order to provide further miniaturization of medical interventional devices, an electric component (10) of an interventional device is provided. The component comprises a flat carrier base (12), at least one electric circuit (14) provided on a substrate (16) and at least one electric wire (18) connected to the electric circuit by a wire connection (20). The substrate is attached to the carrier base. Further, for the wire connection, the carrier base is provided with at least one opening (22) that is provided at least partly with a conductive edge portion (24), which edge portion is connected to the at least one electric circuit. Still further, the substrate is provided with at least one recess (26) aligned with the location of the at least one opening in the carrier base. Furthermore, an end portion of the wire is arranged in the at least one recess; and the end portion of the wire is conductively coupled to the conductive edge portion by electrically conductive material (30).

This disclosure discloses a display device including: a display panel; a backlight module including a light-emitting diode group; the display panel including a first substrate and a second substrate successively along the direction from the backlight module, wherein the first substrate includes an exposed area which is not covered by the second substrate, and an orthographic projection of the light-emitting diode group on the first substrate lies in the exposed area; a protective cover plate on the light exit side of the display panel; a housing on the side of the backlight module away from the display panel, and is grounded; and a conductive structure, wherein an orthographic projection of the conductive structure on the first substrate at least partially overlaps with the orthographic projection of the light-emitting diode group on the first substrate, and the conductive structure connects the protective cover plate with the housing.

A circuit board includes a conductive plate held by a holding member, an insulation sheet provided on one side of the conductive plate, and a circuit component that is placed on the conductive plate and that has a terminal, and a void portion is formed in the insulation sheet, and a conductive material for electrically connecting the conductive plate and the terminal to each other is applied to a region that is exposed from the void portion on the one side of the conductive plate.