A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.

An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

An electronic apparatus includes a display panel and a chassis member that are fixed by a tensile-peelable first adhesive tape, second adhesive tape, and third adhesive tape. The first adhesive tape is located along a first edge of the chassis member. The third adhesive tape is located along a third edge of the chassis member. The second adhesive tape is located between the first adhesive tape and the third adhesive tape and orthogonal to the first adhesive tape and the third adhesive tape. The first adhesive tape and the third adhesive tape respectively have a first tab and a third tab for tensile peeling operation extending to a second edge of the chassis member. The second adhesive tape has a second tab for tensile peeling operation extending from one end thereof to the second edge.

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a surface including a first cavity; a first die at least partially nested in the first cavity and electrically coupled to the substrate; and a circuit board having a surface including a second cavity, wherein the surface of the substrate is electrically coupled to the surface of the circuit board, and wherein the first die extends at least partially into the second cavity in the circuit board.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

Provided is an electrically conductive solderable gasket configured to be not easily separated or detached from a circuit board by external force after the electrically conductive solderable gasket is mounted on the circuit board by soldering. The gasket includes: a single-body metallic support and an elastic electrical contact terminal which is superposed on an upper portion of the support and into which portions of the support are fitted, wherein the support includes a fixing portion, extensions bent upward from both lengthwise ends of the fixing portion, and first and second fitting portions bent inward respectively from upper ends of the extensions, wherein the first and second fitting portions are fitted into a through-hole of the electrical contact terminal and overlap each other in a state in which a lower surface of a metal layer of the electrical contact terminal is placed in contact with the fixing portion.

A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.