A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.

A package substrate and a manufacturing method thereof, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.

Provided is a method of measuring eccentricity of a blind via hole formed in a printed circuit board including an inner-layer board and an outer-layer board that are bonded by thermocompression bonding. The method includes acquiring, by a microscope camera, an image by photographing a marker which is formed on a surface of the outer-layer board and a blind via hole which is exposed upward through a marker hole formed in a center of the marker with a microscope camera, and measuring, by computing equipment connected to the microscope camera, eccentricity indicating a separation distance and a separation direction from central coordinates of the marker hole to central coordinates of the blind via hole using a distance between an end point of the marker hole and an end point of the blind via hole which are included in the image.

A multilayer board includes laminates. Each of the laminates includes a liquid crystal polymer substrate and a metal layer. Each of the liquid crystal polymer substrates has a melting point. When a number of the liquid crystal polymer substrates is an odd number, they include a first middle substrate that is located in the most middle position and has a first melting point lowest among the melting points. The melting points increase in a direction away from the first middle substrate. When the number of the liquid crystal polymer substrates is an even number, they include second and third middle substrates that are located in the most middle position and respectively have second and third melting points that are substantially same. The second or third melting point is lowest among the melting points. The melting points increase in a direction away from the second and third middle substrates.

Provided is a method of measuring eccentricity of a blind via hole formed in a printed circuit board including an inner-layer board and an outer-layer board that are bonded by thermocompression bonding. The method includes acquiring, by a microscope camera, an image by photographing a marker which is formed on a surface of the outer-layer board and a blind via hole which is exposed upward through a marker hole formed in a center of the marker with a microscope camera, and measuring, by computing equipment connected to the microscope camera, eccentricity indicating a separation distance and a separation direction from central coordinates of the marker hole to central coordinates of the blind via hole using a distance between an end point of the marker hole and an end point of the blind via hole which are included in the image.

A component-containing substrate includes a substrate base. The substrate base includes one or more wiring layers and one or more insulating layers and includes a cavity. The component-containing substrate further includes a pad at the bottom of the cavity and an electronic component bonded to a surface of the pad exposed in the cavity. A trench is formed in the surface of the pad, the trench continuing from the inside to the outside of the perimeter of the electronic component in a plan view.

Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.

A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A control unit having a connection structure for connecting components of the control unit to a base plate which is cost effective, and facilitates heat transfer from a printed circuit board (PCB) to the base plate. The control unit includes circuitry mounted to a PCB, and the PCB is mounted to a base plate. The circuitry is over molded with epoxy material during manufacturing. The epoxy material flows between the PCB and the base plate, such that a layer of the epoxy is disposed between the PCB and the base plate. This layer of epoxy functions as a heat transfer layer, and a connection structure to connect the PCB to the base plate. The epoxy material transfers heat from the surface of the PCB in contact with the layer of epoxy to the surface of the base plate in contact with the layer of epoxy.