A package for an optical module includes a substrate that includes a first wiring layer, a second wiring layer, and a third wiring layer. The package includes a first insulating layer between the first wiring layer and the second wiring layer, the first insulating layer including first vias. The package includes a second insulating layer between the second wiring layer and the third wiring layer, the second insulating layer including second vias and third vias. Each first vias is provided between a corresponding second via and a corresponding third via. The first vias are arranged at a first interval along a first direction. The second vias are arranged at a second interval along the first direction. Each second vias is disposed at an offset by half of the second interval from the corresponding third via.

The printed circuit board according to the embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface of the first insulating layer or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and to surround the second circuit pattern; wherein the second circuit pattern is an outermost circuit pattern, wherein the second circuit pattern and the second insulating layer are disposed to protrude on the upper surface of the first insulating layer, and wherein a height of the second circuit pattern is greater than a height of the second insulating layer.

In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. A component is embedded in the at least one rigid portion. A transition region between the at least one semi-flexible portion and the at least one rigid portion of the component carrier has a slanted sidewall.

A resin sheet that contains one or more kinds of resin materials and a liquid crystal polymer, wherein a weight of the liquid crystal polymer is less than a total weight of the one or more kinds of resin materials. The resin sheet has a thermal expansion coefficient in a plane direction smaller than a thermal expansion coefficient in the plane direction of a comparative resin sheet containing the one or more kinds of resin materials and not containing the liquid crystal polymer.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side. The printed circuit board illustratively further includes a thermally conductive, electrically insulating additive resin filling spaces between the electrically conductive material in both the first and second patterned layers of each of the plurality of double-sided laminates, such that the electrically conductive material and the additive resin together form planar surfaces that contact the plurality of pre-preg sheets.

A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.

Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).