A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.

A method of fabricating an interposer includes: providing a carrier substrate; forming a unit redistribution layer on the carrier substrate, the unit redistribution layer including a conductive via plug and a conductive redistribution line; and removing the carrier substrate from the unit redistribution layer. The formation of the unit redistribution layer includes: forming a first photosensitive pattern layer including a first via hole pattern; forming a second photosensitive pattern layer including a second via hole pattern and a redistribution pattern on the first photosensitive pattern layer; at least partially filling insides of the first via hole pattern, the second via hole pattern, and the redistribution pattern with a conductive material; and performing planarization to make a top surface of the unit redistribution layer flat. According to the method, no undercut occurs under a conductive structure and there are no bubbles between adjacent conductive structures, thus device reliability is enhanced and pattern accuracy is realized.

The present invention relates to methods and systems that utilize a catalyst or thin metal film by atomic level deposition (ALD) of one or more metals that allows fine traces deposition to the trench formed in a dielectric material, thereby minimizing potential physical damage due to embedded conductor format and making the fine space between traces to prevent electromigration in the traces.

A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. A circuit pattern and a dielectric layer covering the circuit pattern are formed on a dielectric substrate. A conductive via connected to the circuit pattern is formed in the dielectric layer. A photoresist material layer is formed on the dielectric layer. An imprinting process is performed on the photoresist material layer using a stamp to form a patterned photoresist layer, wherein the pressing side of the stamp facing the circuit pattern becomes sticky when subjected to pressure so as to catch photoresist residue from the photoresist material layer in the imprinting process. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed.

In fabricating a wiring structure, a first wiring is formed on a substrate. First and second light sensitive insulation layers that are reactive to light of first and second wavelength ranges, respectively, are sequentially formed on the first wiring. First and second exposing processes are performed using the light of the first and second wavelength ranges, respectively, to form first and second exposed portions in the first and second light sensitive insulation layers, respectively. The first and second exposed portions are removed by a developing process to form a hole and an opening, respectively. The hole and the opening extend through the first and second light sensitive insulation layers, respectively, to be connected to one another. A conductive layer is formed in the hole and in the opening, and is planarized to form a first via and a second wiring in the hole and in the opening, respectively.

A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.

A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.

A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.