A printed circuit board which improves the peel strength of a wiring pattern formed at a cavity bottom portion while enabling connection between an electronic component inside a cavity and a circuit outside the cavity to be performed at the cavity bottom portion, includes a cavity in a partial region of a multilayer substrate laminated with an insulating resin layer and an electrical conductor layer on a bottom layer of an insulating resin substrate. The cavity opens on a side of the insulating resin substrate, penetrates the insulating resin substrate, and includes a surface of the insulating resin layer as a bottom surface. The electrical conductor layer has a surface, the surface having a height equivalent to a height of the surface of the insulating resin layer and being embedded in the insulating resin layer in a manner to form a portion of the bottom surface.

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

A printed wiring board includes a first insulating layer, a first conductor layer formed on first surface of the first insulating layer, a second conductor layer formed on second surface of the first insulating layer, a first via structure formed in the first insulating layer such that the first via structure is connecting the first and second conductor layers, a second insulating layer formed on the second surface of the first insulating layer such that the second conductor layer is embedded into the second insulating layer, a third conductor layer formed on the second insulating layer, and a second via structure formed in the second insulating layer such that the second via structure is connecting the second and third conductor layers. The second conductor layer includes a dedicated wiring layer which transmits data between two electronic components to be mounted to the first surface of the first insulating layer.

A method for manufacturing a structure for embedding and packaging multiple devices by layer includes preparing a polymer supporting frame, mounting a first device in a first device placement mouth frame to form a first packaging layer, forming a first circuit layer and a second circuit layer, forming a second conductive copper pillar layer and a second sacrificial copper pillar layer, forming a second insulating layer on the first circuit layer, and forming a third insulating layer on the second circuit layer, forming a second device placement mouth frame vertically overlapped with the first device placement mouth frame, mounting a second device and a third device in the second device placement mouth frame to form a second packaging layer, forming a third circuit layer on the second insulating layer. A terminal of the second device and a terminal of the third device are respectively communicated with the third circuit layer.

A wiring board includes a photosensitive insulating layer and a first wiring layer. The photosensitive insulating layer has a hole, a first surface and a second surface opposite to each other. The hole has a first end opening formed in the first surface, a second end opening formed in the second surface, an axis, and a sidewall surrounding the axis. Part of the sidewall extends toward the axis to form at least one annular flange. The first wiring layer is disposed on the first surface and includes a first pad, in which the hole exposes the first pad. There is at least one recessed cavity between the annular flange and the first pad. The minimum width of the annular flange is smaller than the maximum width of the recessed cavity.

A method for manufacturing a multilayer circuit board includes: forming a first patterned conductive layer on a ceramic substrate, the first patterned conductive layer having a first circuit pattern and a first submount pattern; forming a second patterned conductive layer on the first patterned conductive layer, the second patterned conductive layer having a second circuit pattern and a second submount pattern; forming an insulating layer on the ceramic substrate; and forming a third patterned conductive layer on the insulating layer. The third patterned conductive layer having a third circuit pattern and a third submount pattern. The first, second and third submount patterns are stacked one above another.

A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the insulating layer and is at least partially separated from the resin, the conductor layer is formed such that a part of the metal film is between the first inorganic filler particles and the resin from the surface of the insulating layer and that a distance between the surface of the insulating layer and the surface of the insulating layer at a deepest part of the part of the metal film is in the range of 0.1 μm to 0.5 μm.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.