An apparatus is configured to print a circuit board using conductive and nonconductive printing materials in accordance with parameters. A database stores information correlating characteristics of printing materials with shelf life and/or age of the printing materials, and/or environmental conditions. The apparatus either prompts operator to make printing parameter adjustments or automatically optimizes printing parameters based on information stored in the database and the environmental conditions. The apparatus optionally further optimizes printing parameters based on age of a print head and positioning mechanisms.

An illumination apparatus for a vehicle storage cavity is disclosed. The apparatus comprises a circuit disposed proximate to and extending significantly along an opening of the cavity. At least one proximity sensor and a plurality of LEDs suspended in a semiconductor ink are printed on the circuit. The circuit is configured to activate an emission from the LEDs in response to the proximity sensor detecting an object entering the storage cavity.

A photosensitive conductive paste contains conductive particles (A), a photosensitive organic compound (B), an epoxy resin (C) and an ion adsorbent (D) that is selected from the group consisting of hydrotalcite, magnesium oxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, zirconium oxide, magnesium silicate, silicon dioxide, zeolite and a carbon-based powder.

A method of 3D printing in which a 3D product is built up layer by layer by jetting from print heads includes forming part of a 3D product by a functional binder jetting process; jetting one or more material in a 2D pattern to form a structure on said part; completing the formation of the 3D product by continuing the functional binder jetting process, so that said structure becomes embedded in said product. Functional binder jetting may include: providing a layer of a powder bed; jetting a functional binder onto selected parts of said layer, wherein said functional binder infiltrates into pores in the powder bed and locally fuses particles of the powder bed in situ; sequentially repeating applying a layer of powder on top and selectively jetting functional binder, multiple times, to provide a powder bed bonded at selected locations by printed functional binder.

A semiconductor device comprises a first conductive layer. A second conductive layer is formed over the first conductive layer. A semiconductor component is disposed over the first conductive layer. The second conductive layer lies in a plane between a top surface of the semiconductor component and a bottom surface of the semiconductor component. A third conductive layer is formed over the semiconductor component opposite the first conductive layer. The semiconductor device includes a symmetrical structure. A first insulating layer is formed between the first conductive layer and semiconductor component. A second insulating layer is formed between the semiconductor component and third conductive layer. A height of the first insulating layer between the first conductive layer and semiconductor component is between 90% and 110% of a height of the second insulating layer between the semiconductor component and third conductive layer. The semiconductor component includes a passive device.

The present invention relates to a device (1) for enabling high-viscosity conductive and dielectric printing fluids, that are used in commercial and experimental flexible circuit manufacturing practices and included at the universal or experimental development stage, to be printed automatically in compliance with the flexible circuit diagram desired to be printed and without using a flexible base material.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

A wiring board includes a photosensitive insulating layer and a first wiring layer. The photosensitive insulating layer has a hole, a first surface and a second surface opposite to each other. The hole has a first end opening formed in the first surface, a second end opening formed in the second surface, an axis, and a sidewall surrounding the axis. Part of the sidewall extends toward the axis to form at least one annular flange. The first wiring layer is disposed on the first surface and includes a first pad, in which the hole exposes the first pad. There is at least one recessed cavity between the annular flange and the first pad. The minimum width of the annular flange is smaller than the maximum width of the recessed cavity.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.