A solar powered cooler for a smart device such as a smartphone or smart tablet is provided, optionally with a device holder and a solar powered charger unit. The cooler may include an upper fan casing, an optional bottom fan casing, smart device holder, and an air passage formed between the upper fan casing and the smart device holder. The heat dissipation structure of the smart device holder for holding a smart device is disposed in the close proximity space of the smart device to provide a good heat dissipation effect by way of active cooling (forced convection) and passive cooling (natural convection) so as to enhance the heat dissipation performance of the smart device.

The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.

A docking station has a base, a main casing, a cover body, a ventilation layer, and multiple first lateral openings. The main casing forms a first inner space and has multiple first through-holes. The ventilation layer is in gaseous communication with the first inner space via the first through-holes. The cover body is fixed to the main casing, and the ventilation layer is formed between the cover body and the main casing. The first lateral openings are formed in the cover body and in gaseous communication with the ventilation layer. When in use, heat generated by electronic components inside the first inner space makes air inside the first inner space flow upwards to the ventilation layer and subsequently exits the docking station via the first lateral openings. Meanwhile, cool air enters the first inner space via the first lateral openings to dissipate heat.

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprise at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy include transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

A method of fixing a flexible printed circuit (FPC) and a mobile terminal are provided. The mobile terminal includes: a rear cover; a first FPC fixedly connected to the rear cover; a front housing provided with a battery accommodation compartment; in case that a battery is installed in the battery accommodation compartment, there is a gap between the battery and the first FPC.

The technical field to which the invention pertains is securing objects from unauthorized use by children at home. ChargerSafe is a child-proofing apparatus to be used by parents to limit children-s screen time. ChargerSafe is a vented metal box with a combination, biometric, or digital lock and round openings with protective grommets in the sides that allow the user to thread charging cables from external electrical outlets to the inside where electronic devices (phones, tablets, chromebooks) are placed, plugged in, and charged with the door locked. Removable dividers are added inside to prevent devices from stacking. The principal use of the invention is locking devices up as a solution to the problem of screen time management at home. ChargerSafe combines the functions of securely storing electronic devices to prevent unauthorized use by children, while charging these devices at the same time.

A configurable data center platform includes an enclosure configured to affix to a support structure, the enclosure configured for housing one or more processing systems that form a data center, one or more transceivers configured to enable the one or more processing systems to communicate with one or more remote devices, one or more sensors; and an electrical power distribution subsystem configured to condition a received electrical current to one or more conditioned electrical currents that power the one or more processing systems and the one or more sensors, wherein the enclosure comprises a cooling system that removes heat from the one or more processing systems and the one or more sensors.

The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.

An electronic device includes a display panel, a first circuit board electrically connected to the display panel, a second circuit board electrically connected to the display panel and spaced apart from the first circuit board in a first direction, and a housing including an internal space that accommodates the display panel, the first circuit board, and the second circuit board, the housing includes a first opening exposing the internal space and closer to the first circuit board than to the second circuit board, and a second opening exposing the internal space, spaced apart from the first opening, and disposed between the first circuit board and the second circuit board, and holes passing through the housing are included in each of the first opening and the second opening of the housing.

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.